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CARE® Computer Aided Reliability Engineering

Overview

CARE® technology maximizes product reliability
The analysis of electronic and mechanical systems is based on the assumption that the system will function in a particular environment and may fail at any time randomly or according to the inherent failure distribution.

At times, a failure in a system might cause the user some inconvenience, but at other times, the impact might be more severe and even cause the loss of human life.

CARE® is a set of software tools that can simulate all kinds of failures in a system and the effects of such failures on system behavior.

CARE® will help to develop a more reliable system, with cost effective hardware, while shortening the design and time to market.

CARE® simulates all potential functional and process failures (electrical/ electronic/ mechanical and software). For high availability systems, CARE® recommends the optimal redundancy needed to achieve the highest availability at a minimum hardware cost.

CARE® is used in the preliminary design as Top-Bottom allocation/analysis and in the full -scale development as a Bottom-To-Top prediction/analysis.

CARE® has been integrated in all well-known design CAD/CAE systems and uses the data in real time when generated by the designer. This helps to shorten the design cycle.

CARE® is applicable to electronic and mechanical systems

For Electronic design, CARE® helps select the correct parts according to the stress load & temperature. CARE® reduces the PCB size to insert test points, to improve the Built-in-Test capabilities, to reduce the PCB failure rate and  to improve network availability.

For Mechanical Design, CARE® helps to reduce wear-out, aging, fatigue, cracks, corrosion, loss of strength and reduces the individual part failure rate as well as for complex mechanical system.

Electro-mechanical System

CARE includes the following modules:

 

  1. MTBF: Mean Time Between Failures (Prediction & Allocation):
    • Mil-HDBK-217
    • RIAC 217Plus
    • Bellcore
    • HRD-5
    • IEC-62380
    • SN-29500
    • NSWC-98 (Mechanical Parts)
    • FIDES 
  2. SDTA: Stress Derating and Thermal Analysis
  3. FMEA/FMECA: Failure ModesEffects and Crtiticality Analysis
  4. TA: Testability Analysis
  5. FTA: Fault Tree Analysis
  6. MTTR: Mean Time To Repair
  7. RBD: Reliability Block Diagram, Basic, Network and Markov
  8. MRS: Mechanical Reliability Simulations

 

 CARE is a registered trademark of BQR

Key benefits

  1. Provides reliability measurements during design
  2. Helps to identify the most unreliable parts for improving
  3. Provides dictionary for failure modes and the effects on the system behavior
  4. Reduces the time needed from RAMS analysis and provides results to the designer much faster
  5. Reduces the time needed to perform RAMS analysis

Resource Center

CARE Download Area

Please note that many downloadable files are large. These may take some time to download, depending on your computer setup and internet connection speed.
Zipped files must be decompressed using any zip utility software before use.
 
 CARE Brochure:

The Brochure describe the capabilities and the features of the CARE Software.

 

CARE Brochure.pdf CARE Brochure
 

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