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Practical Reliability and Maintenance Symposia

Overview

BQR is sponsoring and maintaining the

Practical Reliability and Maintenance Symposia 

in several locations worldwide.

Symposia Schedule:

 

 

 Month June 2007  July 2007  Aug 2007  Sep 2007  Oct 2007  Nov 2007  Dec 2007  Jan 2008  Feb 2008 March 2008 April 2008 May 2008
                         
Munich 29      13     13           
 Milan         18-19               
 Maryland, USA   16-17        5-6   
 Tel-Aviv 26      25    19     28      
 London          22-23              
 Amsterdam              5-6          
 

 

Year 2007 will address the electronic and mechanical industries

You are invited to submit presentation proposals that address the Symposium theme: 
"Sharing applications, success stories and lessons learned in reliability and maintainability of electronic and mechanical design engineering"

The 2007 International Symposium provides a forum for expert presenters from various industries, universities and government to come together with Circuit Boards designers, EDA Users, mechanical engineers and reliability practitioners to learn and understand the common cause that initiate failure in electronics and mechanical, and provide a comprehensive review of the tools and techniques used to identify those potential failures to meet real world challenges.  

Keynote Address
The Keynote Address will be delivered at 09:00 by Mr. Yizhak Bot President and CTO of BQR Reliability Engineering Ltd. The topic of the address will be: "Design to Reliability in the Electrical and Mechanical Industries – new techniques".

Presentations from Government and Industry
The 2007 Symposium program matrix consists of two parallel tracks with presentations and four in-depth tutorials for each track. Attendees can choose presentations/ tutorials from either track. With two options for every session, you can configure the Symposium experience to meet your specific interests and needs! Presentation topics include:

  • Design for Reliability - Process and Best Practices
  • Developing Stress and De-rating Analysis Methods   
  • Improving Reliability of Electronics Using Advanced Analysis 
  • New predictions models
  • Mechanical reliability of PCB's
  • Thermal aspects in PCB layout and design
  • Mechanical parts life prediction 

 

Experienced practitioners in the field will present these and other topics. Presenting organizations includes Siemens, IBM, RIAC, University of Maryland , DfR Solutions, Mirce Akademy and many more.

In-Depth Tutorials
The Symposium offers four in-depth tutorials on key PCB reliability and related topics. Tutorial instructors are experts in the principles, theory and applications of the relevant analysis methods/techniques, with extensive experience providing training and analysis for industry applications. The tutorial subjects include:

  • The new 217+ model
  • Electrical Stress de-rating criteria
  • Mechanical Stress for PCB
  • New IC reliability prediction

 

Registration Details
The 2007 Symposium is organized by BQR Reliability Engineering Ltd.  Abstracts must be submitted two months prior to the symposium. The authors of selected articles will be notified one month after. For registration details and the complete program matrix for the Symposium please contact
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Gallery

Seminar: Practical Life testing for complex electronic systems, February  28, 2008 Crown Plaza Tel Aviv

Seminar Pictures


 

Innovation in Reliability Predictions 26 June, 2007 Sheraton-Tel-Aviv.

tOne hundred Engineers participated in the Seminar.

Seminar Pictures


 

 

 

 

 

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