BQR is sponsoring and
maintaining the
Practical Reliability
and Maintenance Symposia
in several locations
worldwide.
Symposia Schedule:
|
Month |
June 2007 |
July 2007 |
Aug 2007 |
Sep 2007 |
Oct 2007 |
Nov 2007 |
Dec 2007 |
Jan 2008 |
Feb 2008 |
March 2008 |
April 2008 |
May 2008 |
| |
|
|
|
|
|
|
|
|
|
|
|
|
| Munich |
29 |
|
|
13 |
|
|
13 |
|
|
|
|
|
| Milan |
|
|
|
|
18-19 |
|
|
|
|
|
|
|
|
Maryland, USA |
|
16-17 |
|
|
|
5-6 |
|
|
Tel-Aviv |
26 |
|
|
25 |
|
19 |
|
|
28 |
|
|
|
| London |
|
|
|
|
22-23 |
|
|
|
|
|
|
|
|
Amsterdam |
|
|
|
|
|
|
5-6 |
|
|
|
|
|
Year 2007 will address the electronic and
mechanical industries
You are invited to submit presentation proposals that
address the Symposium theme:
"Sharing applications, success stories and lessons learned in reliability and
maintainability of electronic and mechanical design engineering"
The 2007 International Symposium provides a forum for expert presenters
from various industries, universities and government to come together with
Circuit Boards designers, EDA Users, mechanical engineers and reliability
practitioners to learn and understand the common cause that initiate failure in
electronics and mechanical, and provide a comprehensive review of the tools and
techniques used to identify those potential failures to meet real world
challenges.
Keynote Address
The Keynote Address will be delivered at 09:00 by Mr. Yizhak Bot President and
CTO of BQR Reliability Engineering Ltd. The topic of the address will be:
"Design to Reliability in the Electrical and Mechanical Industries – new
techniques".
Presentations from Government and Industry
The 2007 Symposium program matrix consists of two parallel tracks with
presentations and four in-depth tutorials for each track. Attendees can choose
presentations/ tutorials from either track. With two options for every session,
you can configure the Symposium experience to meet your specific interests and
needs! Presentation topics include:
- Design for Reliability - Process and Best Practices
- Developing Stress and De-rating Analysis Methods
- Improving Reliability of Electronics Using Advanced
Analysis
- New predictions models
- Mechanical reliability of PCB's
- Thermal aspects in PCB layout and design
- Mechanical parts life prediction
Experienced practitioners in the field will present
these and other topics. Presenting organizations includes Siemens, IBM, RIAC,
University of Maryland , DfR Solutions, Mirce Akademy and many more.
In-Depth Tutorials
The Symposium offers four in-depth tutorials on key PCB reliability and related
topics. Tutorial instructors are experts in the principles, theory and
applications of the relevant analysis methods/techniques, with extensive
experience providing training and analysis for industry applications. The
tutorial subjects include:
- The new 217+ model
- Electrical Stress de-rating criteria
- Mechanical Stress for PCB
- New IC reliability prediction
Registration Details
The 2007 Symposium is organized by BQR Reliability Engineering Ltd.
Abstracts must be submitted two months prior to the symposium. The authors of
selected articles will be notified one month after. For registration details and
the complete program matrix for the Symposium please contact
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Seminar: Practical Life testing for complex
electronic systems, February 28, 2008 Crown Plaza Tel Aviv
Innovation
in Reliability Predictions 26 June, 2007 Sheraton-Tel-Aviv.
tOne
hundred Engineers participated in the Seminar.