FIDES - Reliability Methodology for Electronic Systems
The FIDES Guide is a global methodology for reliability engineering in electronics. It has two parts:
- A reliability prediction guide,
- A reliability process control and audit guide.
The FIDES Guide aims to enable a realistic assessment of the reliability of electronic equipment, including systems operating in severe environments (defense systems,aeronautics, industrial electronics, transport, etc.). The FIDES Guide also aims to provide a concrete tool to develop and control this reliability.
By identifying the factors contributing to reliability, whether chnological, physical or process-based, the FIDES Guide makes it possible to revise product definition and intervene throughout the product lifecycle, to improve and control reliability.
The FIDES methodology is based on the physics of failures and supported by the analysis of test data, field returns and existing modeling. It is therefore different from the traditional methods developed mainly through statistical analysis of field returns.
This process yields predicted reliability results that are not influenced by the industrial domains of the methodology's creators.
FiDES covers the following components:
- INTEGRATED CIRCUITS
- DISCRETE SEMICONDUCTORS
- CAPACITORS AND THERMISTORS (CTN)
- RESISTORS AND POTENTIOMETERS
- INDUCTORS AND TRANSFORMERS
- RELAYS
- PCB and CONNECTORS
- PIEZOELECTRIC PARTS
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