Innovation in Reliability Predictions 26 June, 2007 Sheraton-Tel-Aviv, Israel
Purpose: The seminar will provide guidance in understanding the new reliability prediction models such as: 217+, Fides, IEC and others for electronic complex systems. The prediction includes passive, active, programmable, mechanical and PCB/assemblies to achieve more accurate and realistic results. The seminar will provide knowledge and new techniques in selecting the correct prediction models for a product and the correct implementation.
General: Most of the companies which develop electronic systems invest in calculating MTBF and document the results in a report. Since there is a gap between the predictions and the field results, the usage of such results are limited only to satisfy a customer need Investing correctly in reliability predictions will result in adding an engineering aspects in decision making in: dependencies in frequency and operating voltage with field failures, reducing number of "No Failure Found" in return PCB/assemblies, selecting components/technologies, predicting the correct number of spares needed to support the maintenance, identifying the optimal maintenance concept and additional aspects which will raise up in the seminar.
Topics:
- The need for reliability prediction for new technologies
- The innovation of reliability prediction at the chip, PCB/assembly and system level
- Failure rate distribution, exponential or not?
- Stress derating models
- Passive and active components failure rate prediction models
- Programmable components models
- PCB/assemblies models
- The effect of temperature, humidity, vibration and shocks
- Integration to system
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Final Agenda
Registration
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08:30 – 09:30 |
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The Prediction Process
The new Requirements for Reliability Predictions and their effect on Maintenance Reliability innovations at the chip, PCB/assembly and system level
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09:30 – 10:30 |
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Comparison between the different prediction Models
- Description and Comparison between the models:+217 , FIDES, IEC, CNET, Bellcore and Telcordia
- Failure rate distribution, exponential or not?
- Stress de-rating models
- Reliability and the dependencies on electrical stress
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10:30 – 11:15 |
Coffee Break
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11:15 – 11:30 |
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Comparison between the different Models (Continues)
- Passive and active components failure rate prediction models
- Programmable components models
- PCB/assemblies models
- The effect of temperature, humidity, vibration and shocks
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11:30 – 12:30 |
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Field Data Analysis
- Different types of Field Failures and their Ratios
- The Stresses and temperature affecting the number of PCB’s Returns
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12:30 – 13:00 |
Lunch
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13:00 – 14:00 |
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Chip Reliability Models
- Frequency and Voltage influence on Chip Reliability
- Stress and Temperature Influence on Chip Reliability
- New age methods for Chip reliability Prediction
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14:00 – 15:30 |
Coffee Break
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15:30 – 15:45 |
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PCB Reliability Models
- Soldering, Welding and Connections Influence on PCB Reliability
- Vibration and shock Influence on PCB Reliability
- Failure rate distributions for PCB
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15:45 – 16:30 |
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System Level Integration
Integration of failure rates to PCB level and system level, failure rates Integration problems
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16:30 – 17:00 |
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BQR Reliability Engineering Ltd.
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l http://www.bqr.com/
Telephone: (972) 3 9625911
Gallery:
One hundred Engineers participated in the Seminar.
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