As fiXtress analyses are performed before PCB layout is done, and real thermal data is not known, this module estimates the board temperature increase due to self-heating, and takes this information to be used during Component Derating Analysis and MTBF prediction.
The module takes into account the exact power dissipation of each component, and estimates the average temperature rise above the coldplate temperature (dT).
An example is presented in the following table:
The PCB coldplate temperature is 71ÖC, dT is 6.4ÖC, generating components temperature of 77.4ÖC.
The tool adds for each component the internal component heat, e.g. Tj=83.4ÖC for U3.