June 26, 2007, Sheraton Hotel, Tel-Aviv, Israel: Innovation in Reliability Predictions

Purpose: The seminar will provide guidance in understanding new reliability prediction models such as: 217+, Fides, IEC and Telcordia for electronic complex systems. The prediction covers passive, active, programmable, mechanical and PCB/assemblies, and is designed to achieve more accurate and realistic results. The seminar will provide knowledge and new techniques for selecting the correct prediction models for a product and implementing them properly.

General: Most of the companies which develop electronic systems invest in calculating MTBF and document the results in a report. Since there is a gap between predictions and field results, the usage of such results is limited to satisfying customer needs. Proper investment in reliability predictions will result in adding an engineering aspect to the decision making process relating to: dependencies in frequency and operating voltage with field failures, reducing number of “No Failure Found” in return PCB/assemblies, selecting components/technologies, predicting the correct number of spares needed to support maintenance, identifying the optimal maintenance concept and additional aspects.

Topics

• The need for reliability prediction in new technologies
• The innovation of reliability prediction at the chip, PCB/assembly and system level
• Failure rate distribution, exponential or not?
• Stress derating models
• Passive and active component failure rate prediction models
• Programmable component models
• PCB/assemblies models
• The effect of temperature, humidity, vibration and shocks
• Integration in the system