Derating Analysis for Electronic Components

¿Qué es el análisis de reducción de potencia de componentes?

The maximum rating for applied component stress (current, voltage, power, temperature, etc.) is defined by the manufacturer, and even stricter derating guidelines are defined to increase product robustness. Component derating analysis defines the optimal operating range for each component.

 

Why You Need Component Derating Analysis

Component damage may occur when it is subjected to power, current, voltage, or temperature which surpass its maximum stress rating.
Electrical overstress affects product performance, and is the leading cause of field returns.

Figure 1: Typical failure Pareto analysis

 

Many engineers select components that have a maximal rating which is twice the expected actual stress. However, as temperatures increase, component performance deteriorates, this practice becomes insufficient, and derating guidelines must be applied.

 

Component derating analysis helps you select the optimal components rating according to stress load and temperature.

Figura 2: Ejemplo de guía de reducción de potencia de componentes

 

El análisis detecta componentes sobrevalorados (rojo) y sobrevalorados (amarillo). Los componentes sobre-diseñados también se detectan cuando la tensión es mucho menor que la calificación.
In many companies, the process is performed manually and includes time-consuming tasks: Calculating component stresses and comparing the result with the derating guidelines for each component type.

 

BQR Component Derating Analysis

The BQR solution automates the manual process of component stress and derating analysis, optimizing the component selection for reliability and cost effectiveness.

Features:

• Plug-Ins for major E-CADs (Altium, Mentor, OrCad) provide easy BOM import as well as presenting results on the schematic design.
• Stress can be input semi-automatically, or calculated using a unique circuit stress simulator.
• Las pautas de reducción se pueden personalizar de acuerdo con los estándares [1-6] o la práctica de su empresa.
• Thermal placement guidelines in the form of a Pareto list, for optimal placement during layout.

Usos adicionales para resultados de estrés:

Once the component stresses are defined, additional analyses can be held:

• BQR’s patented schematic review detects a wide variety of design errors before layout. Some of the errors depend on stress, for example: incorrect applied voltage.
• BQR’s MTBF calculation software uses the defined stresses for realistic MTBF prediction.

 

 

Referencias:

[1] ECSS-Q-ST-30-11C Garantía de producto espacial - Reducción de potencia - Componentes EEE
[2] Directriz de reducción de potencia de la Marina de los EE. UU., SD-18
[3] Comando espacial de la fuerza aérea SMC Estándar SMC-S-010
[4] Instrucciones EEE-INST-002 de la NASA para la selección, detección, calificación y reducción de potencia de las piezas EEE
[5] Parámetros de rendimiento IPC-9592 para dispositivos de conversión de energía
[6] Mil-Hdbk-338 Manual militar Manual de diseño de confiabilidad electrónica