fiXtress
Automated Derating | Thermal Analysis |
MTBF Prediction for Single and Multi-PCB Designs |
Industry-leading patented AI Technology
Key Features:
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East-to-use AI technology for fast and flawless designs.
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Conducts in-depth component derating analysis.
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Predicts MTBF (Mean Time Between Failures) for single boards or entire systems.
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Predicts Board Temperature: Estimates how much a PCB's temperature will rise due to heat generation.
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Ready to use derating standards.
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Users can define their own derating standards
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Detects all EOS (Electrical Over Stress). violations with Pareto, over-stress and over-design reports.
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Thermal analysis that estimates the average temperature rise over the cold-plate, for accurate stress derating.
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Calculates an accurate MTBF based on real electrical and thermal stresses.
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MTBF prediction for all available standards.
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Drives reliability data automatically to all RAMS analyses (FMECA, FTA, RBD, MTTR).
Benefits:
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Optimizes component selection for reliability and cost-effectiveness.
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Ensures that electronics last longer and perform flawlessly.
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Enables optimal thermal performance in design.
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Saves significant time through automation and streamlined workflows.
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How It Works:
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fiXtress® employs electrical stress analysis on components within your circuit design to perform Component De-rating.
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The stress input is utilized for predicting MTBF, ensuring robust reliability in your system.
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Calculation of board self-heating is conducted by considering component power dissipation and thermal resistance, optimizing thermal performance.
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Component rated values and thermal resistance data are stored in a comprehensive library for convenient and efficient future utilization.
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Key Features
Parts Derating Analysis
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Identifies over-stressed and over-designed components.
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Utilizes an ECAD Plug-In for quick stress assignment.
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Automates the process, optimizing component selection for reliability and cost-effectiveness.
Mini Thermal Anakysis – Average PCB Heating
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Estimates average PCB temperature rise for accurate stress derating.
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Enables optimal component placement before PCB layout.
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Prevents overdesign or overstress with early thermal analysis.
Cloud MTBF
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Provides a cloud-based solution for efficient MTBF calculations.
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Enables easy data sharing and collaboration on reliability analyses.
Realistic MTBF Prediction
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Provides a realistic estimate of the mean time to product failure.
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Calculates accurate MTBF based on real electrical and thermal stresses.
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Supports multiple industry standards for MTBF prediction
ECAD Plug-In
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Serves as an add-on for major EDA tools like Altium, Mentor, OrCad.
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Improves design robustness by detecting errors in the schematic phase.
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Streamlines the design process and accelerates time to market.
MTBF Prediction
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Predicts Mean Time Between Failures (MTBF) using industry-standard methodologies (MIL-HDBK 217F2, Telcordia 3, FIDES, IEC 62380, and more).
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Easy import of product tree from CAD systems, quick access to component parameters, and part number libraries.
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Comprehensive analysis, including failure rates, service life, and environmental considerations.
Benefits
Ready-to-Use Derating Standards
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Utilize predefined derating standards for quick analysis.
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Define custom derating standards to meet specific requirements.
Unique Thermal Analysis
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Estimates average temperature rise over the cold-plate for accurate stress derating.
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Prevents unexpected breakdowns by keeping components within safe temperature limits.
Automated Processes
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Automates component stress and derating analysis, saving valuable time.
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Provides automated design error detection, optimizing component selection and reliability.
Comprehensive Error Detection
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Detects all Electrical Over Stress (EOS) violations using Pareto, over-stress, and over-design reports.
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Ensures adherence to derating guidelines for optimal component selection.
Seamless Integration
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Works as an add-on for any EDA tool, offering a reliable crystal ball for electronic reliability.
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Supports easy import/export of data from various sources, maintaining data traceability.
Industry Compliance
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Supports a range of industry standards for derating and MTBF prediction.
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Ensures your design follows best practices and industry guidelines.
How fiXtress Works
Automated Derating Analysis
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Automates the process of assessing stress levels for electronic components.
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Utilizes Plug-Ins for major E-CADs (Altium, Mentor, OrCad) for easy Bill Of Materials (BOM) import.
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Offers both semi-automatic stress assignment and logical stress calculations for an incomplete design.
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Customizable derating guidelines based on industry standards or your company’s practice.
ECAD Integration
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Serves as an add-on for Electronic Design Automation (EDA) tools like Altium, OrCad, and Mentor.
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Improves design robustness by detecting errors during the schematic phase.
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Streamlines the design process, accelerating time to market.
Early Thermal Assessment
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Estimates board temperature increase before PCB layout, crucial for optimal component size selection.
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Provides a Mini Thermal Analysis module, calculating average temperature rise over the cold-plate for accurate stress derating.
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Enables effective design changes and prevents overdesign or overstress in the final product.
Comprehensive Reliability Solution:
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Offers a suite of modules, including Component Derating, Realistic MTBF Prediction, Mini Thermal, Rapid Stress Assignment, ECAD Plug-In, and Cloud MTBF.
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Allows users to define derating standards, detect EOS violations, and perform a failure Pareto analysis.
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Drives reliability data automatically to all RAMS analyses, ensuring a thorough assessment for better design.