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Why You Need Early Thermal Analysis
Thermal analysis is the basis for other analyses such as component derating and MTBF calculations.
Early thermal and component derating analysis enables detection of overstressed components, resulting in optimal component size selection before PCB layout and component placement.
This enables the designer to perform design changes easily and cost-effectively.
With the information provided by the Mini-Thermal Analysis module, users can place warm components in a cooler area before layout, and define the proper cooling method and the airflow level.
This helps create an effective cooling system, and prevents overdesign or overstress.
fiXtress Mini Thermal Analysis
The fiXtress module estimates the board temperature increase based on self-heating, as fiXtress analyses are performed before PCB layout, and actual thermal data is still unknown.
This information is then used during the component derating analysis and MTBF prediction.
The module takes into account the exact power dissipation of each component, and estimates “The average temperature rise above the cold-plate temperature”, dT(영형C).
The module takes the thermal data and package type of each relevant component, creates the thermal model and solves the equations resulting in dT(영형C).
An example is presented in the following table:
The PCB cold-plate temperature is 71 T(영형C),
fiXtress Mini Thermal Analysis tool calculated dT(영형C) to be 6.4영형C,
Generating average components temperature of (71+6.4) = 77.4영형C.
Then, the tool adds for each component the internal component heat, e.g.
티제이=83.4영형C for U3.