Optimize thermal design using actual components’ stress
Thermal analysis is an important part of any electronic system design.
Electronic devices that consume high power require heat removal mechanisms such as PCB substrate, heat sinks or fans.
Thermal analysis is usually performed by mechanical engineers or 3rd party companies that specialize in simulating heat and air flow. This analysis requires information about the components placing on the PCB, actual power dissipation and PCB materials and geometry.
Usually, the thermal analyst conducts the calculation using the absolute maximum power rating from the components’ datasheets. The actual power is often significantly lower than the maximum rating. This leads to overdesign of the heat removal mechanisms.