Multi Board Integration


Each PCB, when simulated and tested individually, can operate flawlessly, but when it is integrated with other boards, connection errors may arise, which can burn the PCB or create a malfunction on the system level. This module reduces such risks by
verifying the connectivity between several PCBs and saves time otherwise wasted on redesign.

The schematic design represented by the BOM and Netlist is used to calculate the electrical stress of the components. the ground signals specification and the ICD data are also needed to set power input constraints. These calculations use data from the Components Database, which includes the components’ electrical properties from the datasheet. The data is used to calculate DC operational parameters, such as power dissipation, voltage and current. Results are then provided to the Stress Derating Analysis module.

fiXtress Rapid is a simple, effective Design for Reliability (DFR) software that accelerates and optimizes the design process. fiXtress Rapid enables the user to reduce development time, by performing conflict identification and stress calculation during early design stages. The software includes customized derating and thermal modules which create more reliable products, resulting in major reduction of failures in the field.

•  Performs rapid Electrical Stress Analysis (ESA) and derating
•  Improves overall product reliability and life
•  Based on worst case scenario
•  Detects electrical stress errors during schematic design
•  Detects design and Net names conflicts
•  Provides accurate MTBF and Service Life Result

The fiXtress Rapid Stress Calculation Advantage

fiXtress Rapid replaces manual stress calculations, performed by the design engineer during the design process, with a rapid automated process.
The automated analysis assists in the selection of components based on appropriate derating levels, identifies voltage level conflicts in pins of ICs and net-names, assists in the implementation of standard Net naming guidelines, and offers preliminary thermal placement guidance.
Instead of performing calculations for the entire design, fiXtress Rapid can analyze each circuit independently, allowing early identification of problems when repairs are easier and most cost effective.
fiXtress Rapid operation method enables different engineers to work on the same design simultaneously, while maintaining high design standards and making the integration of the designs easier and quicker.

fiXtress Rapid was designed in accordance with market demand, tailored to the needs of a busy engineer who needs to achieve best results with minimal effort.
Stress Analysis is one of the design concepts that are often overlooked, but can improve not only product reliability but also company reputation.

Stress Analysis Impact Areas

•  Product lifecycle
•  Product reliability
•  Lower returns and complaints
•  Reduced PCB maintenance cost
•  Direct increase in predicted MTBF

fiXtress Rapid implementation, integration time and cost are relatively low while the return related to product improvement can be much higher, both in terms of cost and company reputation.

 

fiXtress Rapid Workflow

rapid stress calculation workflow

 Data import

 • ICD import ‒ The ICD data from the schematic design is imported and used as the power supply input source.
  • Netlist and BOM import ‒ The design’s updated Netlist and BOM are imported in every iteration for worst case scenarios.

fiXtress Rapid Analysis

          The schematic design, represented by the BOM and Netlist, is used to calculate the electrical stress of the components, using parametric data from the Components Database, such as stress ratings and stress calculation parameters.
This data is used to calculate the operational parameters, such as power dissipation, voltage, current and junction temperature, while using ICD as power input constraints. During this process, fiXtress Rapid also identifies design and net name conflicts.

      fiXtress Rapid then checks if the components’ stress values meet the derating criteria based on worst case scenarios.

Back annotations (output)

Based on the stress analysis, fiXtress Rapid provides the design engineer with the following back annotations:

  •            List of over-stressed components
  •       Design and net name conflicts
  •       Thermal placement guidelines – Pareto list starting with the components’ highest temperature for optimal placement during layout

The process can be quickly repeated for each design modification, by simply importing the updated Netlist and BOM.