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fiXtress
Automated Derating | Thermal Analysis |
MTBF Prediction for Single and Multi-PCB Designs |
Industry-leading patented AI Technology

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Key Features:

  • East-to-use AI technology for fast and flawless designs.

  • Conducts in-depth component derating analysis.

  • Predicts MTBF (Mean Time Between Failures) for single boards or entire systems.

  • Predicts Board Temperature: Estimates how much a PCB's temperature will rise due to heat generation.

  • Ready to use derating standards.

  • Users can define their own derating standards

  • Detects all EOS (Electrical Over Stress). violations with Pareto, over-stress and over-design reports.

  • Thermal analysis that estimates the average temperature rise over the cold-plate, for accurate stress derating.

  • Calculates an accurate MTBF based on real electrical and thermal stresses.

  • MTBF prediction for all available standards.

  • Drives reliability data automatically to all RAMS analyses (FMECA, FTA, RBD, MTTR).

Benefits:

  • Optimizes component selection for reliability and cost-effectiveness.

  • Ensures that electronics last longer and perform flawlessly.

  • Enables optimal thermal performance in design.

  • Saves significant time through automation and streamlined workflows.

How It Works:

  • fiXtress® employs electrical stress analysis on components within your circuit design to perform Component De-rating.

  • The stress input is utilized for predicting MTBF, ensuring robust reliability in your system.

  • Calculation of board self-heating is conducted by considering component power dissipation and thermal resistance, optimizing thermal performance.

  • Component rated values and thermal resistance data are stored in a comprehensive library for convenient and efficient future utilization.

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Key Features

Parts Derating Analysis

  • Identifies over-stressed and over-designed components.

  • Utilizes an ECAD Plug-In for quick stress assignment.

  • Automates the process, optimizing component selection for reliability and cost-effectiveness.

Mini Thermal Anakysis – Average PCB Heating

  • Estimates average PCB temperature rise for accurate stress derating.

  • Enables optimal component placement before PCB layout.

  • Prevents overdesign or overstress with early thermal analysis.

Cloud MTBF

  • Provides a cloud-based solution for efficient MTBF calculations.

  • Enables easy data sharing and collaboration on reliability analyses.

Realistic MTBF Prediction

  • Provides a realistic estimate of the mean time to product failure.

  • Calculates accurate MTBF based on real electrical and thermal stresses.

  • Supports multiple industry standards for MTBF prediction

ECAD Plug-In

  • Serves as an add-on for major EDA tools like Altium, Mentor, OrCad.

  • Improves design robustness by detecting errors in the schematic phase.

  • Streamlines the design process and accelerates time to market.

MTBF Prediction

  • Predicts Mean Time Between Failures (MTBF) using industry-standard methodologies (MIL-HDBK 217F2, Telcordia 3, FIDES, IEC 62380, and more).

  • Easy import of product tree from CAD systems, quick access to component parameters, and part number libraries.

  • Comprehensive analysis, including failure rates, service life, and environmental considerations.

benefits

Benefits

Ready-to-Use Derating Standards

  • Utilize predefined derating standards for quick analysis.

  • Define custom derating standards to meet specific requirements.

Unique Thermal Analysis

  • Estimates average temperature rise over the cold-plate for accurate stress derating.

  • Prevents unexpected breakdowns by keeping components within safe temperature limits.

Automated Processes

  • Automates component stress and derating analysis, saving valuable time.

  • Provides automated design error detection, optimizing component selection and reliability.

Comprehensive Error Detection

  • Detects all Electrical Over Stress (EOS) violations using Pareto, over-stress, and over-design reports.

  • Ensures adherence to derating guidelines for optimal component selection.

Seamless Integration

  • Works as an add-on for any EDA tool, offering a reliable crystal ball for electronic reliability.

  • Supports easy import/export of data from various sources, maintaining data traceability.

Industry Compliance

  • Supports a range of industry standards for derating and MTBF prediction.

  • Ensures your design follows best practices and industry guidelines.

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how it works

How fiXtress  Works

Automated Derating Analysis

  • Automates the process of assessing stress levels for electronic components.

  • Utilizes Plug-Ins for major E-CADs (Altium, Mentor, OrCad) for easy Bill Of Materials (BOM) import.

  • Offers both semi-automatic stress assignment and logical stress calculations for an incomplete design.

  • Customizable derating guidelines based on industry standards or your company’s practice.

ECAD Integration

  • Serves as an add-on for Electronic Design Automation (EDA) tools like Altium, OrCad, and Mentor.

  • Improves design robustness by detecting errors during the schematic phase.

  • Streamlines the design process, accelerating time to market.

Early Thermal Assessment

  • Estimates board temperature increase before PCB layout, crucial for optimal component size selection.

  • Provides a Mini Thermal Analysis module, calculating average temperature rise over the cold-plate for accurate stress derating.

  • Enables effective design changes and prevents overdesign or overstress in the final product.

Comprehensive Reliability Solution:

  • Offers a suite of modules, including Component Derating, Realistic MTBF Prediction, Mini Thermal, Rapid Stress Assignment, ECAD Plug-In, and Cloud MTBF.

  • Allows users to define derating standards, detect EOS violations, and perform a failure Pareto analysis.

  • Drives reliability data automatically to all RAMS analyses, ensuring a thorough assessment for better design.

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Case Study

Defense Firm Utilizes BQR Software for Safety Event Probability Calculations

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