top of page
Modern Minimalist Simple Technology Banner(8)_edited_edited.jpg



Bridging Reliability Analysis and Multi-Board Design with AI

Automated Component De-rating Analysis |

Thermal Analysis | MTBF Prediction |

For Single/Multi-Board Electronic Designs at the Pre-layout Stage |

Powered by Industry-Leading Patented AI Technology |

Untitled design(122).png

Key Features:

  • East-to-use AI technology for fast and flawless designs.

  • Conducts in-depth component derating analysis.

  • Predicts MTBF (Mean Time Between Failures) for single boards or entire systems.

  • Predicts Board Temperature: Estimates how much a PCB's temperature will rise due to heat generation.

  • Ready to use derating standards.

  • Users can define their own derating standards

  • Detects all EOS (Electrical Over Stress) violations with Pareto, over-stress and over-design reports.

  • Thermal analysis that estimates the average temperature rise over the cold-plate, for accurate stress derating.

  • Calculates an accurate MTBF based on real electrical and thermal stresses.

  • MTBF prediction for all available standards.

  • Drives reliability data automatically to all RAMS analyses (FMECA, FTA, RBD, MTTR).

  • Integrates with design tools: Works seamlessly with the most popular ECAD software for in-workflow analysis.


  • Optimizes component selection for reliability and cost-effectiveness.

  • Ensures that electronics last longer and perform flawlessly.

  • Enables optimal thermal performance in design.

  • Saves significant time through automation and streamlined workflows.

How It Works:

  • fiXtress® employs electrical stress analysis on components within your circuit design to perform Component De-rating.

  • The stress input is utilized for predicting MTBF, ensuring robust reliability in your system.

  • Calculation of board self-heating is conducted by considering component power dissipation and thermal resistance, optimizing thermal performance.

  • Component rated values and thermal resistance data are stored in a comprehensive library for convenient and efficient future utilization.

Untitled (1920 x 500 px) (1920 x 1920 px) (3000 x 3000 px) (Presentation)(5).png
Untitled design(2).png
Anchor 5
Anchor 1
Untitled design(33).png

Key Features

Parts Derating Analysis

Identifies over-stressed and over-designed components.

Utilizes an ECAD Plug-In for quick stress assignment.

Automates the process, optimizing component selection for reliability and cost-effectiveness.

Mini Thermal Anakysis – Average PCB Heating

Estimates average PCB temperature rise for accurate stress derating.

Enables optimal component placement before PCB layout.

Prevents overdesign or overstress with early thermal analysis.

Predict MTBF with Confidence

MTBF prediction capabilities comply with the following standards:

  • MIL-HDBK 217F2 / G: Reliability Prediction of Electronic Equipment

  • MIL-HDBK 217F2 with VITA 51.1: Reliability Prediction of Electronic Equipment

  • FIDES 2009, FIDES 2022: Reliability Methodology for Electronic Systems. FIDES 2022 ensures:

  1. More realistic failure rate values supporting more modern components

  2. New package categories for ICs

  3. Added classifications X5R and X7R for Type-2 ceramic capacitors

  4. Model for Plastic film capacitors

  • IEC 62380: Universal Model for Reliability Prediction of Electronics Components, PCBs, and Equipment.

  • IEC 61709: Electric Components – Reliability – Reference Conditions for Failure Rates and Stress Models for Conversion.

  • Telcordia: Reliability Prediction Procedure for Electronic Equipment.

  • HDBK GJB299: Reliability Prediction Handbook for Electronic Equipment.

  • SN 29500: Failure Rate, Component, Expected Value, Dependability.

  • HRD 5: Handbook of Reliability Data for Electronic Components.

  • NSWC: Handbook of Reliability Prediction Procedures for Mechanical Equipment.

Realistic MTBF Prediction

Provides a realistic estimate of the mean time to product failure.

Calculates accurate MTBF based on real electrical and thermal stresses.

Supports multiple industry standards for MTBF prediction

Predicts Mean Time Between Failures (MTBF) using industry-standard methodologies (MIL-HDBK 217F2, Telcordia 3, FIDES 2022, IEC 62380, and more).

Easy import of product tree from CAD systems, quick access to component parameters, and part number libraries.

Comprehensive analysis, including failure rates, service life, and environmental considerations.

ECAD Plug-In

Serves as an add-on for major EDA tools like Altium, Mentor, OrCad.

Improves design robustness by detecting errors in the schematic phase.

Streamlines the design process and accelerates time to market.



Ready-to-Use Derating Standards

  • Utilize predefined derating standards for quick analysis.

  • Define custom derating standards to meet specific requirements.

Unique Thermal Analysis

  • Estimates average temperature rise over the cold-plate for accurate stress derating.

  • Prevents unexpected breakdowns by keeping components within safe temperature limits.

Automated Processes

  • Automates component stress and derating analysis, saving valuable time.

  • Provides automated design error detection, optimizing component selection and reliability.

Comprehensive Error Detection

  • Detects all Electrical Over Stress (EOS) violations using Pareto, over-stress, and over-design reports.

  • Ensures adherence to derating guidelines for optimal component selection.

Seamless Integration

  • Works as an add-on for any EDA tool, offering a reliable crystal ball for electronic reliability.

  • Supports easy import/export of data from various sources, maintaining data traceability.

Industry Compliance

  • Supports a range of industry standards for derating and MTBF prediction.

  • Ensures your design follows best practices and industry guidelines.

Anchor 2
how it works

How fiXtress®  Works

Automated Derating Analysis

  • Automates the process of assessing stress levels for electronic components.

  • Utilizes Plug-Ins for major E-CADs (Altium, Mentor, OrCad) for easy Bill Of Materials (BOM) import.

  • Offers both semi-automatic stress assignment and logical stress calculations for an incomplete design.

  • Customizable derating guidelines based on industry standards or your company’s practice.

ECAD Integration

  • Serves as an add-on for Electronic Design Automation (EDA) tools like Altium, OrCad, and Mentor.

  • Improves design robustness by detecting errors during the schematic phase.

  • Streamlines the design process, accelerating time to market.

Early Thermal Assessment

  • Estimates board temperature increase before PCB layout, crucial for optimal component size selection.

  • Provides a Mini Thermal Analysis module, calculating average temperature rise over the cold-plate for accurate stress derating.

  • Enables effective design changes and prevents overdesign or overstress in the final product.

Comprehensive Reliability Solution:

  • Offers a suite of modules, including Component Derating, Realistic MTBF Prediction, Mini Thermal, Rapid Stress Assignment, ECAD Plug-In, and Cloud MTBF.

  • Allows users to define derating standards, detect EOS violations, and perform a failure Pareto analysis.

  • Drives reliability data automatically to all RAMS analyses, ensuring a thorough assessment for better design.

Anchor 3
Anchor 4
bottom of page