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fiXtress®:
Automated Electrical Stress Derating, Thermal & MTBF Prediction-
From schematic to full RAMS analyses
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Electrical Stress & Derating • Mini‑Thermal • EOS • MTBF Prediction
fiXtress® delivers comprehensive system level electrical stress/derating, EOS risk detection, mini‑thermal estimation, and MTBF prediction. It consumes schematic/BOM data (via Synthelyzer® or Excel), applies standard or corporate derating rules, estimates PCB temperature rise, and predicts MTBF under selected standards. Results are cross‑probed to ECAD and passed to CARE® for FME(C)A/FTA/RBD.
fiXtress® is On-Prem (not cloud).
Watch a short fiXtress® intro and discover a smarter, stress-free way to perform MTBF calculations and derating - all done in minutes.
Key Modules
Part Stress Analysis
System level component derating analysis including derating guidelines manager.
Library Editor
Elaborate components libraries for derating and MTBF prediction, including web access to millions of components.
MTBF Prediction
System level MTBF Calculation supporting international standards.
Reports
Detailed Pareto reports identifying leading failure drivers.
Mini-Thermal Analysis
Estimate component temperature rise above ambient temperature before layout.
Key Features
Comprehensive electrical stress and derating analysis
Across all system assemblies, accounting for product operational profile.
Realistic MTBF Prediction
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Under true electrical and thermal stresses (supports industry standards; see list below).
Provide Reliability Data
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Hand‑off to FME(C)A, FTA, RBD, MTTR and logistics analyses in CARE® modules.
Mini‑Thermal:
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Estimates average PCB temperature rise from IC/device dissipation for early component placement and derating.
Derating Graphs Manager
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With ready‑to‑use standards and custom company‑specific rules.
Seamless ECAD Integration
BOM import via Synthelyzer® plug‑ins for in‑workflow analysis.
EOS violation detection
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With Pareto, over‑stress, and over‑design reports, plus actionable design recommendations.
Extensive Component Library
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AI‑assisted with auto ‑ completed parameters and web access to millions of parts.
MTBF Graphs
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As function of temperature and environment, including pareto reports.
Advanced Analysis & Modeling
Environment & Mission Profiles
Aligned with reliability standards for stress and MTBF assumptions.
Detailed Component Derating
Accounting for temperature, operational stresses and specific derating guidelines per component type, complies with ECSS and other standards.
​Service Life
Calculate System service life for different confidence levels.
Predict MTBF with Confidence
Supports multiple industry standards for robust,
realistic predictions:
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MIL‑HDBK‑217F2 / G and VITA 51.1 addendum
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FIDES 2009 and FIDES 2022 (updated failure rates, modern IC packages, X5R/X7R classes)
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IEC 62380
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Telcordia (Bellcore) SR‑332 methodologies
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HDBK GJB299 (China)
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SN 29500 (Siemens)
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HRD‑5 (Handbook of Reliability Data)
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NSWC (mechanical procedures)
Screenshots
Table:
System breakdown tree down to component level.
Graph:
MTBF as a function of temperature according to prediction methods.
Derating Guideline:
Stress % vs. Temperature for each component type.
Core Benefits
Design Efficiency
Automate manual stress/derating tasks and reduce human error.
Cost & weight Optimization
Flag over‑designed components and suggest right‑sized alternatives.
Enhanced Reliability
Detect overstressed parts early to prevent field failures and rework.
System‑wide insight
MTBF, life expectancy, and critical component identification at a glance.
Faster Development
Shorten the system MTBF verification process with actionable recommendations for improvement.
Comprehensive traceability
Analyses linked to schematic/BOM revisions for V&V.
HOW It Works
Data intake
Import schematic/BOM from ECAD via Synthelyzer®; map part parameters from the fiXtress® library.
Stress & mini‑thermal
Compute electrical derating and estimate average PCB temperature rise using dissipation/thermal resistance.
Reliability prediction
Calculate MTBF with the selected standard(s), factoring the actual electrical & thermal stresses.
Design feedback & traceability
Publish findings (violations, Pareto, recommendations) back to ECAD and feed CARE® analyses.
Integration with BQR's Toolchain
fiXtress® operates as part of BQR’s integrated
RAMS ecosystem:
Extracts schematic/BOM from ECAD and assigns initial stresses.
Precise circuit simulation
Consolidates RAMS results (FME(C)A, FTA, RBD, MTTR) for system‑level decision support.
Together, these tools provide a digital‑twin reliability workflow from schematic to system safety and reliability.
Outputs & KPIs
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Overstress flags with quantitative margins (%) and recommended corrective actions for each component.
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Estimated assembly MTBF with Pareto of top reliability contributors.
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MTBF vs. Temperature graphs for all environments and prediction methods.
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Failure rates outputs for FMEA / FMECA, RBD and FTA.
Typical Use Cases
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PDR / CDR design gate MTBF / derating sign‑off.
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Supplier / OEM design assurance.
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Derating compliance preparation.
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Basis for FMECA, Spare Parts and RBD calculations.