Electrical Stress Derating & Electrical Over Stress (EOS) Analysis
Component derating checks if the operating point for each component is within acceptable electrical and temperature stress limits.
EOS is the second most common typical failure.
30%-65% of PCBs are declared by field technicians as failed due to over stress components. This dramatically increases the number of PCBs in the pipeline, causing manufacturers large losses.
fiXtress includes special rules that can detect such errors based on the Automated Stress Analysis module, saving time and capital.
Material damage may occur when an electronic device is subjected to a power, current, voltage or temperature that is beyond the stress limits of the device.
EOS affects product performance until the component burns. It is the leading cause of returns in components, IC and system failures during operation
EOS causes damage to the materials, and product recalls, since this design error is embedded in all PCBs in the field.
fiXtress detects all EOS errors while increasing PCB reliability, and saving time and money.
Stress Derating Analysis
Component derating Analysis helps designers select the appropriate components Rating according to stress load and temperature. Stress Derating Analysis compares the calculated worst-case electrical stress parameters (current, voltage, power, junction temperature etc.) with the maximum component rating and predefined derating profile.
to detect over-Rating (red) and over-derated (yellow) components. The derating profile can be customized by users according to their own practices. Over-designed components are also detected when stress is much lower than rating. The software generates thermal placement guidelines in the form of a Pareto list, for optimal placement during layout.