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Introduction: The intricate nature of communication systems, encompassing various frequency bands, receivers, transmitters, encryption units, and end devices, poses significant challenges. BQR took on the task of conducting a RAM analysis for a leading defense company, specifically focusing on a complex communication system. The Complex Challenge: The challenge at hand involved calculating the reliability and availability of a system with numerous units and shared failure modes, necessitating a comprehensive analysis. Solution: To address this challenge, BQR employed its suite of software tools, including apmOptimizer, RBD, and FTA. Through these tools, BQR not only conducted a thorough analysis but also provided recommendations for minor adjustments and the necessary spare parts to align with the operational requirements of the end customer. Results: The outcomes of the RAM analysis were pivotal in achieving successful Preliminary Design Review (PDR) and Critical Design Review (CDR). These milestones paved the way for a seamless integration and installation process at the customer site, ensuring that the communication system met the specified operational standards.

Product design is a complex process that often involves bureaucracy and document preparation to show compliance with regulations and customer requirements.Reliability, Availability, Maintainability and Safety (RAMS) analyses are standard requirements in industries such as aerospace, defense, rail, automotive, medical, and maritime. A key parameter in these analyses is Reliability.When test or field data exists, the data can be used for reliability calculation. However, when designing a new product this information is not available, and accelerated life tests are expensive and time consuming. Therefore, reliability prediction is done following industry specific standards (MIL-HDBK-217, FIDES, Telcordia, IEC, Physics of Failures, reliability physics etc.). Each prediction method requires a set of data which represents the design such as: environment, temperature, components type, PCB structure, vibration, duty cycle and most importantly: the electrical stress on each component. During reliability analysis you can choose between two strategies: 1. Improve the report: This attitude is geared toward the short-term goal of providing fast satisfactory reports.You can quickly get a reliability prediction by using a default assumption of 50% electrical stress on the components.However, this will not prevent your product from malfunctioning due to over-stressed components and other design errors that you failed to identify.Another issue is that in most designs the actual stress is less than 50%, therefore this conservative assumption only provides a lower limit of the reliability.The 50% stress assumption also provides high calculated power and temperature which may result in over-design (for example: adding unnecessary heat sinks).To improve the report you may calculate actual stresses on a few key components, but most design errors and over-stressed components remain hidden.  2. Improve the product This attitude is geared toward the product improvement, or as one of our customers said: “We have to do these reports, so we might as well learn something from them”.By calculating the actual electrical stresses you gain:  Early identification of overstressed components and design errors  Identify over-designed components that can be replaced with more economic ones  Increase your product reliability and robustness  Increase accuracy of the reliability predictionCalculating the component stresses is good practice that should be implemented as part of the design process. BQR provides a complete solution for advanced DRC/ERC and component electrical stress analysis and derating, as well as reliability, availability, maintainability, and safety analysis.BQR’s solutions include software and/or professional services.

In the realm of healthcare systems, ensuring the safety and reliability of medical devices is paramount. At BQR, we understand the critical importance of meeting stringent safety standards and mitigating potential risks. Our suite of innovative products, including CARE® (which facilitates FMEA, FTA analysis, and FMEDA), CircuitHawk™ (for streamlined schematic review and circuit simulation), fiXtress® (for component derating and MTBF prediction), and apmOptimizer® (for reliability analysis and supply chain optimization), is designed to revolutionize the healthcare industry by addressing key challenges faced by medical device manufacturers and healthcare providers. ​ Medical Device Compliance and Safety Medical devices must adhere to rigorous safety standards to ensure the health and well-being of patients. Our products cater to various medical device classifications, ensuring compliance with safety requirements tailored to the device's level of risk. With features like risk analysis integrated into the design process, our solutions enable early identification and rectification of design flaws, ultimately preventing costly recalls and legal liabilities. Global Fleet Maintenance Optimization Managing worldwide fleets of medical devices presents logistical challenges for OEMs, particularly in terms of maintenance and support. BQR offers comprehensive solutions for reliability and maintainability analyses, facilitating efficient fleet management by analyzing failure modes, optimizing repair processes, and minimizing downtime and associated costs. Performance and Risk Management Hospitals and medical centers operate diverse services, each with unique procedures. Our tools empower healthcare professionals to enhance performance and patient satisfaction by identifying and rectifying potential inefficiencies. Through proactive intervention and outcome monitoring, BQR's solutions ensure optimal service delivery and patient care. Empowering Healthcare Professionals with BQR Solutions BQR provides a range of software and professional services tailored to meet the diverse needs of healthcare organizations: Empowering Healthcare Professionals with BQR Solutions BQR provides a range of software and professional services tailored to meet the diverse needs of healthcare organizations: CircuitHawk™ : Streamline schematic review and circuit simulation for critical electronics, ensuring optimal performance and reliability. fiXtress® : Facilitate component derating and MTBF prediction to enhance the reliability of medical devices. CARE® : Ensure compliance with industry standards such as ISO 14791 and conduct reliability and safety assessments using methodologies like FMEA and FTA. apmOptimizer® : Conduct maintainability analysis and supply chain optimization to streamline fleet management and reduce operational costs. In conclusion, BQR is committed to driving innovation and excellence in healthcare systems through our cutting-edge solutions. By leveraging our products, medical device manufacturers and healthcare providers can enhance patient safety, optimize performance, and achieve greater operational efficiency. Join us in shaping the future of healthcare with BQR.

Testing by Simulation to Improve Robustness, Reliability, and Safety ​ To verify the quality and reliability of electronic circuits, massive testing is required. Furthermore, manual safety verification is needed in order to comply with various IEC/ISO standards. BQR introduces a new type of safety and reliability simulation (instead of massive testing and manual analysis) which detects hidden design errors before manufacturing the first prototype for testing. The simulation reduces design cycles thereby saving money and reducing TTM. The product becomes best in class, free of hidden design errors, and improves the manufacturer's reputation. Circuit simulator for design error detectionBQR offers software and professional service for component stress analysis by circuit stress simulation. The simulation includes several layers to cover all potential failure types, as follows:  Automated calculations of electrical operational parameters such as Voltage and Current for each IC Pin, Net, and Pad. Performing a component derating analysis and providing electrical constraints for the next step  Automated design and schematic analysis which tests all ICs and semiconductors and compares the previous electrical constraints to components’ datasheets requirements  Provide full electrical stress analysis and derating to avoid over-stress and over-design Help to select the optimal components size/rating for the operational temperature  Calculate the MTBF and provide accurate electrical stress data for Life (Probability of failures vs. time) and Physics of Failure- PoF  Automated components failure modes and safety analysis (FMEA/FMECA/FTA)  The analysis includes electronic hardware and software failures  Guide the final verification test plan  Automatically generate all IEC/ISO standards reports for the authorities  Reports at the component, board, and system levels in early design stages Unique Features: The new simulation is integrated with major E-CAD tools such as Altium, OrCAD, and Mentor  All data related to the simulation is embedded in the schematic database, so if there is a design change it can be done easily  Data is organized in libraries for easy reuse. Following is an example design error that was identified using BQR’s simulation software: In the figure below transistor Q1 provides digital input to pin 40 of U1. It should be above 2.3V for “1” logic, and below 1.0V for “0” logic. But Q1 provides 1.052V which U1 will intermittently interpret as “1” or “0”.This design error results in unstable U1 functionality which is difficult to detect and isolate.

White Paper: Lessons Learned From Implementation in an Aerospace Company   In this article, we will introduce a new “Engineering & RAMS Digitalization” system (RAMS-D), which will shorten the time needed to perform RAMS analyses and product qualification testing. This method will ensure robust and reliable products with fast Time to Market. From analyzing the time spent on doing RAMS analyses we found that more than 50% of the time is spent on collecting product data and preparing it for the RAMS analyses. This digitalization system reduces the time spent creating and standardizing the data. The digital model includes templates that are plugged into the designer CAD system, IEC standards that standardize the data such as ICD Interface Control Document (IEC- 63238-1), and new processes on how to create the data. This method will help designers from different organizations to generate data in the same format for RAMS analyses. This new method was implemented during one year in an aerospace company successfully. This article describes the method and its implementation.

​ Abstract:   Thermal analysis plays a critical role in achieving a reliable and efficient Printed Circuit Board (PCB) design. This paper explores the significance of performing thermal analysis early in the design process, highlighting the benefits of proactive thermal management. It introduces the fiXtress ® Mini Thermal Analysis module, a powerful tool for estimating temperature rise and identifying potential thermal issues before PCB layout and component placement are finalized. Keywords: Thermal Analysis, PCB Design, Component De-rating, MTBF, fiXtress ®  Mini Thermal Analysis ​ 1. Introduction ​ Reliable thermal management is essential for ensuring the functionality and longevity of electronic devices. In PCB design, thermal analysis plays a crucial role in achieving optimal performance and preventing component failures. This analysis lays the groundwork for other critical processes like component de-rating and Mean Time Between Failures (MTBF) calculations. ​ 2. Benefits of Early Thermal Analysis ​ Performing thermal analysis early in the design process, alongside component de-rating analysis, offers several advantages: Early Identification of Stressed Components: By proactively analyzing thermal behavior, engineers can identify components that may be under potential thermal stress due to self-heating. This allows for adjustments to be made before finalizing the PCB layout and component placement. Optimal Component Selection: Early thermal analysis enables the selection of appropriate component sizes based on their power dissipation and thermal characteristics. This prevents over-engineering with unnecessarily large components or using smaller components that could experience thermal stress. Cost-Effective Design Changes: Early detection of thermal issues allows for adjustments to be made to the layout before the PCB is manufactured. This avoids costly rework and delays associated with addressing thermal problems after PCB fabrication. ​ 3. fiXtress ®  Mini Thermal Analysis ​ The fiXtress ® Mini Thermal Analysis module is a valuable tool for early thermal assessment in PCB design. Since the PCB layout is not yet finalized, this module estimates the board's temperature rise based on the self-heating characteristics of individual components. ​ 3.1 Functionality of fiXtress ®  Mini Thermal Analysis ​ The fiXtress ®  Mini Thermal Analysis module operates through the following steps: Precise Power Dissipation: The module takes into account the exact power dissipation of each component on the PCB. Temperature Rise Estimation: Based on the power dissipation data, the module estimates the "average temperature rise above the cold-plate temperature" (dT°C). Thermal Model Creation: Utilizing the thermal data and package types of relevant components, fiXtress creates a thermal model and calculates the dT°C. 3.2 Example: Applying fiXtress ®  Mini Thermal Analysis ​ Here's a practical example demonstrating the application of fiXtress ®  Mini Thermal Analysis: Scenario: PCB cold-plate temperature (T°C) is 71°C. fiXtress ®  Analysis: The module calculates the dT°C to be 6.4°C. Estimated Average Component Temperature: This translates to an average component temperature of (71°C + 6.4°C) = 77.4°C. Internal Component Heat Dissipation: The tool additionally considers the internal heat dissipation of each component (e.g., Tj = 83.4°C for component U3). ​ 4. Validation and Conclusion ​ The accuracy of the fiXtress ® Mini Thermal Analysis results is validated by comparing them with the temperature map generated by a separate 3D thermal simulation tool. The close match between the results demonstrates the effectiveness of the fiXtress ®  Mini Thermal Analysis module in providing a reliable early assessment of PCB thermal behavior. ​ ​ By incorporating f iXtress® Mini Thermal Analysis feature into the design process, engineers can proactively identify potential thermal issues and make informed decisions regarding the component selection and layout optimization. This proactive approach leads to a more efficient and reliable PCB design, ultimately enhancing the performance and longevity of the final product. ​ Learn more  about fiXtress ®

The Crucial Role of Electrical Stress Assignment in Circuit Design ​ Electrical stress assignment is a fundamental step in circuit design, playing a critical role in ensuring the reliability, longevity, and overall functionality of a product. Here's a breakdown of its importance: 1.  Preventing Component Failure: By analyzing the stresses acting on each component (voltage, current, temperature, etc.), engineers can identify potential weaknesses. This allows them to proactively choose appropriate components with sufficient ratings to handle the expected stresses. This prevents premature component failures, leading to a more robust and reliable circuit. 2. Optimizing Design Choices: Understanding the stress distribution within a circuit allows designers to make informed decisions about component selection and layout. They can prioritize components with better stress tolerance in critical areas and optimize the circuit layout for better heat dissipation. This optimization leads to a more efficient and cost-effective design. 3. Enhancing Circuit Performance: Excessive stress on components can negatively impact circuit performance. For example, high voltage stress can lead to leakage currents, while high thermal stress can degrade component performance. By managing stress levels, designers can ensure optimal performance of the circuit and maintain its intended functionality throughout its lifespan. 4. Regulatory Compliance: Many electronic products must adhere to safety regulations that specify stress limits for various components. Proper stress assignment helps ensure compliance with these regulations, mitigating potential safety hazards and preventing product recalls. 5. Streamlining Design Workflow: While not the primary focus, efficient stress assignment tools can save valuable time during the design process. Automating calculations and providing insights can free engineers for more creative and strategic tasks. ​ fiXtress®: Streamlining Stress Management for Efficient Design ​ Introducing fiXtress® – a revolutionary design solution that optimizes your workflow and empowers you to overcome the challenges of stress assignment. Its innovative Rapid Stress Assignment feature is a game-changer, offering significant time and resource savings. Let's delve into how fiXtress® simplifies stress assignment and propels you towards greater design efficiency. ​ How Rapid Stress Assignment Works ​ fiXtress® Rapid employs sophisticated mechanisms to streamline stress simulation for incomplete designs: Concurrent engineering: Empower multiple engineers to collaborate seamlessly on a single design. With fiXtress Rapid, team collaboration becomes fluid, accelerating project progress. Pre-BOM freeze analysis: Make informed decisions before finalizing your Bill of Materials (BOM). fiXtress® Rapid's analysis aids in selecting appropriate component ratings early in the design phase, ensuring a smoother transition to subsequent stages. Utilizes schematic design and data: Leveraging the BOM and Netlist, fiXtress® Rapid calculates electrical stress of components. Ground signal specifications and Interface Control Document (ICD) data are also harnessed to establish power input constraints, ensuring precise stress evaluation. Components Database integration: Access critical electrical properties of components from the Components Database, including data sourced from datasheets. This information is pivotal for computing DC operational parameters such as power dissipation, voltage, and current. Results-driven approach: The calculated results are seamlessly integrated into the Stress De-rating Analysis module, furnishing actionable insights to optimize your design. ​ Advantages of fiXtress® Rapid Stress Assignments ​ Efficiency: Save time and resources with semi-automatic stress assignments and logical calculations. Early-stage assessment: Initiate stress calculations at the onset of the design process, facilitating proactive decision-making. Enhanced collaboration: Foster teamwork among stakeholders with concurrent engineering functionalities. Precision: Harness accurate data from the Components Database for meticulous stress analysis. Don’t let manual stress assignments and incomplete designs impede your progress. Embrace the efficiency and agility of fiXtress®'s Rapid Stress Assignment feature to propel your design endeavors forward. Experience the transformative power of fiXtress® today.

The automotive industry is undergoing a rapid transformation, with a surge in electric vehicles and increasingly complex electronic systems. In this dynamic landscape, ensuring the reliability and longevity of these systems is paramount. Here's where fiXtress® comes in, offering a powerful AI-powered solution that can significantly enhance the design process for modern automobiles. ​ ​ Optimizing Design for Reliability and Performance   fiXtress utilizes cutting-edge AI technology to streamline and empower the design of electronic components within your vehicles. By automating tasks like:   In-depth component derating analysis:  fiXtress ensures components are used within their optimal range, preventing premature failure and extending lifespan. Predicting MTBF (Mean Time Between Failures): Identify potential weak points early in the design phase, allowing for proactive measures to improve overall system reliability. Predicting Board Temperature:  Accurately estimate heat generation and take steps to optimize thermal performance, preventing overheating and malfunctions.   Benefits Beyond Automation   fiXtress® goes beyond automation, offering features that empower engineers:   Ready-to-use and user-defined derating standards:  Ensure designs adhere to industry best practices while allowing for customization based on specific needs. EOS (Electrical Over Stress) violation detection:  Identify and rectify potential electrical stress issues before they cause problems. Comprehensive MTBF prediction:  Gain insights into potential failure rates based on various industry standards. Automatic data integration with RAMS analysis tools: Streamline reliability analysis workflows by automatically feeding data into FMECA, FTA, RBD, and MTTR assessments.   The fiXtress® Advantage   By leveraging fiXtress, automotive companies can achieve:   Optimized component selection:  Choose components that deliver the perfect balance of reliability and cost-effectiveness. Enhanced electronic longevity:   Design electronics that perform flawlessly throughout their intended lifespan. Superior thermal performance:   Ensure optimal heat dissipation within the system, preventing thermal-related issues. Significant time savings:  Automate tedious tasks and streamline workflows, freeing up valuable engineering resources.   fiXtress® represents a significant leap forward in the design of reliable and efficient automotive electronics. By embracing this AI-powered solution,  manufacturers can stay ahead of the curve in the ever-evolving automotive landscape. Learn More About fiXtress®

​ Introduction: The electronics industry thrives on innovation, constantly pushing the boundaries of miniaturization, performance, and functionality. However, ensuring the reliability and quality of these increasingly complex designs remains a critical challenge. Traditional methods of verification and reliability analysis often involve time-consuming manual processes, physical prototypes, and limited error detection capabilities. This can lead to costly delays, rework, and potential safety hazards in the final product. Enter the Era of AI-Powered Design Tools: BQR's CircuitHawk and fiXtress software suite are revolutionizing the electronics design landscape by leveraging the power of generative AI technology. CircuitHawk tackles the verification process, while fiXtress focuses on reliability analysis. Let's delve into how these tools empower seasoned electrical engineers: CircuitHawk: Automating Verification and Early Error Detection: CircuitHawk employs AI-powered verification to streamline the process of identifying design flaws in schematics. This automated schematic review (ASR) replaces manual checks, significantly reducing verification time. The AI algorithms, trained on a vast dataset of design projects and industry best practices, can detect subtle errors that might escape human scrutiny. This early detection allows for prompt corrections, preventing costly rework later in the design cycle. fiXtress: Optimizing Reliability Through In-depth Analysis: fiXtress goes beyond traditional verification by performing comprehensive reliability analysis. It employs AI to analyze electrical stress on components within the circuit. This stress analysis helps predict potential failures by calculating the Mean Time Between Failures (MTBF) for individual components and the entire system. Additionally, fiXtress predicts board temperature rise due to heat generation, enabling optimized thermal design. This holistic approach to reliability empowers engineers to make informed decisions about component selection and design choices, leading to more robust and long-lasting electronics products. Benefits for Electrical Engineers: By incorporating CircuitHawk and fiXtress into their workflow, electrical engineers can: Reduce design cycles significantly through faster verification and streamlined workflows. Enhance design quality by catching errors early and preventing potential failures. Optimize component selection based on real-world stress analysis and MTBF predictions. Focus on innovation by dedicating less time to tedious manual tasks. Conclusion: The integration of AI in BQR's CircuitHawk and fiXtress represents a significant leap forward in electronics design. These tools empower electrical engineers with unparalleled verification and reliability analysis capabilities, paving the way for a future of faster development cycles, enhanced product quality, and superior electronic device reliability.

​Cloud computing services, Web hosting companies and Data Centers guarantee high service availability to the users (up to 99.999%). While industry standards exist for tier I – IV data centers, following the standard does not guarantee the required availability. Therefore, reliability and maintenance optimizations are crucial. Standard spare optimization strategies include sparing for confidence (where the goal is to minimize the probability of a stock-out), and cost optimization (where spare and down-time costs are minimized). However, in the case of cloud services a different approach is needed: sparing for availability.

Introduction: A prominent defense company engaged BQR software to assess the probabilities of premature detonation throughout various mission phases of explosive devices. The objective was to demonstrate adherence to client safety requirements, which mandated a probability threshold lower than 5‧10-8. Given the multifaceted nature of explosive devices, encompassing mechanical, electrical, and electronic protections, potential safety events could arise from combinations of protection failures. Analysis Steps: MTBF Prediction Employ MTBF prediction software to calculate component failure rates in accordance with MIL HDBK 217F2 and NSWC standards. Utilize the MTBF software to generate predictions and assess main tree components. FMEA Import MTBF data into BQR's Failure Mode, Effects, and Criticality Analysis (FMECA) software, automatically assigning component-level failure modes. Conduct FMECA analysis: a. Select the appropriate standard for analysis, with risk matrix, severities list, and criticality or probability groups automatically defined. b. Define the effects of component failures on higher-level assemblies up to the system level. c. Specify severities of system-level failure modes. Automatically generate FMECA reports, detailing the number of failure modes in each severity and risk level. Fault Tree Analysis (FTA) Import the FMECA project into BQR's FTA module as the foundation for Fault Tree Analysis. Conduct FTA analysis: a. Assign the top safety event. b. Define logical relations (gates) between relevant failure modes, eliminating non-relevant failure modes through a top-down process. c. Incorporate "external" events such as probabilities of severe weather and operator error. Automatically calculate the probability of the top event, leading causes, and event combinations. Results: The assessment revealed that the probability of safety events complied with client requirements. Key drivers for safety events were identified, highlighting a significantly higher probability of mechanical failures compared to electronic failures. Consequently, future product development will prioritize enhancing mechanical reliability. The project files were efficiently updated to analyze the safety of product variants.

Achieving a 22.6% Reduction in Annual Maintenance Costs for a Sheet Metal Company Introduction: In the realm of sheet metal production, the reliance on heavy equipment operating at extreme temperatures underscores the critical importance of equipment reliability and maintenance. Failures can lead to production line stoppages, requiring cooling before maintenance interventions can occur. Recognizing these challenges, our sheet metal company sought to enhance equipment reliability and reduce maintenance costs through strategic optimization. Optimization Steps: Collaborating with BQR consulting and leveraging the advanced capabilities of apmOptimizer™ software, our team embarked on a comprehensive optimization process. The key steps included: Analysis of Production Lines and Model Development: Engaged in collaborative efforts with on-site staff, we meticulously analyzed production lines and developed a robust reliability and logistics model. This step was crucial in understanding the intricacies of the equipment and its impact on production. Life Cycle Cost (LCC) Calculation and Identification of Key Drivers: Employing sophisticated methodologies, we calculated the Life Cycle Cost (LCC) and identified pivotal factors contributing to downtime and overall cost implications. This step provided a comprehensive overview of the economic landscape associated with the equipment's life cycle. Optimization of Inspections and Spare Parts Provisioning: With a granular understanding of cost drivers, our team strategically optimized inspections and spare parts provisioning. This involved streamlining the maintenance process to minimize LCC, ensuring a proactive and cost-effective approach to equipment upkeep. Results: The meticulous implementation of optimization strategies yielded significant results, with the sheet metal company realizing a remarkable 22.6% reduction in annual maintenance costs. This achievement stands as a testament to the effectiveness of the collaborative efforts, advanced modeling, and strategic decision-making facilitated by BQR consulting and apmOptimizer™ software. The company now enjoys improved equipment reliability, minimized downtime, and enhanced cost-effectiveness in its maintenance practices.