fiXtress®

Automated Derating Analysis and MTBF Prediction Tool for Board & Multi-Board Design

Optimal Thermal Performance: Facilitates superior thermal performance in designs.
Optimized Component Selection: Enhances component rating selection before layout, reducing design iterations.
Enhanced Durability: Ensures electronics last longer and operate flawlessly.
System-wide Insights: Provides comprehensive views on MTBF, and life expectancy, and detects critical overstressed components for entire systems.
User-Friendly Analysis: Simplifies "what if" analyses for systems, making it easy to adapt products for different environments.
Time Efficiency: Saves significant time through automation and streamlined workflows.

Powerful and User-Friendly: Equipped with AI-powered simulation modules, fiXtress® delivers fast and flawless design capabilities.
Seamless Integration: Compatible with popular E-CAD software for during design in-workflow analysis.
Comprehensive Electrical Stress Analysis: Performs in-depth component electrical stress derating analysis for single or multi-board systems.
Temperature Prediction: Estimates PCB temperature rise due to ICs heat generation, ensuring precise derating.
EOS Violation Detection: Identifies all Electrical over-stress (EOS) violations with Pareto, over-stress, and over-design reports with recommendations.
Derating Graphs Manager: Includes pre-configured derating standards and allows users to define their derating guidelines.
MTBF Prediction: Calculates Mean Time Between Failures (MTBF) for single boards or entire systems, providing accurate reliability data based on real electrical and thermal stresses.
Extensive Component Library: Features an AI-assisted components library manager with auto-fill parameters and access to a vast web library containing millions of components.
Automatic Reliability Data Integration: Streamlines reliability data to other RAMS analyses (FMECA, FTA, RBD, MTTR, and Logistics).

Electrical Stress Analysis: fiXtress® conducts electrical stress analysis on components within your circuit design to perform component de-rating.
Reliability Prediction: It uses electrical stress input to predict MTBF, ensuring realistic MTBF and robust system reliability.
Thermal Optimization: Calculates board self-heating by considering component power dissipation and thermal resistance.
Comprehensive Data Storage: Stores component-rated values and thermal resistance data in an extensive library for thermal simulation and future use.