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Executive Summary In the fast-paced aerospace sector, reliability and efficiency are critical to success. Companies face the challenge of navigating complex design requirements while ensuring that their products meet the highest performance standards. This case study explores how Elix Systems SA, a prominent engineering firm specializing in autonomous flying vehicles, effectively integrated Synthelyzer™ and fiXtress® into their design workflow.The Synthelyzer™ ECAD Plugin plays a pivotal role by generating a comprehensive Bill of Materials (BOM) that includes both board components and operational stresses. This data is then utilized by fiXtress® for system-level derating and Mean Time Between Failures (MTBF) predictions, allowing for a holistic view across multiple boards. The integration of these tools resulted in transformative benefits for Elix Systems, leading to enhanced reliability, streamlined processes, and substantial time savings. Company Overview Elix Systems SA, founded in 2020, boasts a team of seasoned engineers with expertise in video processing, security, and human-machine interfaces. The company specializes in developing electronic systems for demanding industries, including aerospace, defense, and medical. With a commitment to innovation, Elix Systems sought tools that could bolster their design processes and improve product reliability. Initial Challenges Prior to adopting Synthelyzer™ and fiXtress®, Elix Systems faced several challenges: Outsourcing MTBF Calculations:  The company relied on external resources for calculating Mean Time Between Failures (MTBF), which slowed down their workflow and increased costs. Inefficiencies in Component Selection:  The manual process of component derating and selection often led to delays and errors. Lack of Real-Time Analysis:  The team struggled with integrating reliability data into their design processes, hindering their ability to make informed decisions. Solution Implementation Recognizing the need for a comprehensive solution, Elix Systems integrated Synthelyzer™ and fiXtress® into their design workflow. These tools offered powerful capabilities, including: Automated Component Derating:  Synthelyzer™ streamlined the derating process, reducing manual effort and enhancing accuracy. In-House MTBF Prediction:  With fiXtress®, the team could perform MTBF calculations internally, significantly speeding up the design cycle. Real-Time Stress Analysis:  The seamless integration with existing EDA tools allowed for in-workflow analysis, enabling engineers to assess reliability as designs evolved. Results The integration of Synthelyzer™ and fiXtress® delivered measurable benefits to Elix Systems: Increased Efficiency:  By eliminating the need for subcontractors to calculate MTBF, the company reduced design iteration times and increased flexibility. Frederic Guitard, COO, stated, “We can now rely on validated components and generate detailed reports that enhance our decision-making.” Enhanced Product Reliability:  The tools provided comprehensive electrical stress analysis, enabling the team to identify and resolve potential failure points early in the design process. This proactive approach resulted in products that met stringent industry standards. Significant Time Savings:  The automation of manual processes saved valuable engineering hours, allowing the team to focus on innovation and product development. Conclusion Elix Systems SA’s successful integration of Synthelyzer™ and fiXtress® exemplifies the potential of advanced engineering tools to transform design workflows. By enhancing reliability and efficiency, these solutions empower companies in the aerospace industry to meet the challenges of modern electronic design head-on. For organizations seeking to elevate their design processes and improve product performance, the case of Elix Systems underscores the critical role that Synthelyzer™ and fiXtress® can play in achieving these goals. Contact us to learn how fiXtress® and Synthelyzer™ can transform your electronic design processes and drive your company toward unparalleled reliability and innovation.

Introduction Whether you're designing the latest smartphone or working on cutting-edge aerospace systems, electronic circuits are at the heart of your creations. To ensure these circuits perform reliably and last, it's crucial to evaluate them under various electrical and thermal conditions. Electrical stress analysis might sound technical, but it's an essential part of board design that helps prevent failures and boosts performance. In this guide, I’ll walk you through the essentials of electrical stress analysis, share practical insights, and explain how integrating this analysis into your design process can make a real difference in product reliability and durability. What is Electrical Stress Analysis in PCB Design? Think of electrical stress analysis as a diagnostic tool for your electronic circuits. It’s all about assessing how electrical currents, power levels, voltages, and thermal conditions affect your components. This analysis helps you pinpoint potential failure points, select the right components, and tweak your PCB layouts to avoid overstress and overheating. By diving deep into electrical stress, you can catch and address issues before they turn into costly problems, leading to more reliable and robust products. Key Aspects of Electrical Stress Analysis Choosing the Right Components:  Selecting components with the right electrical and thermal ratings is crucial. Look closely at datasheets to understand a component’s maximum power, voltage, current, and temperature limits. By picking components that can handle the expected conditions, you’ll avoid premature failures and keep your designs running smoothly. Derating for Longevity:  Derating means operating components below their maximum rated limits to enhance their reliability and lifespan. Consider factors like ambient temperature and voltage variations in your calculations. By applying derating, you extend the life of your components and reduce the risk of failure due to overstress. Ensuring Power Integrity:  Power integrity is all about maintaining stable voltage levels and minimizing fluctuations that can stress your components. Analyze your board’s power distribution networks to identify and fix issues like voltage drops or noise. This will ensure your system operates reliably and stays stable. Managing Heat with Thermal Simulation:  Effective thermal management keeps your circuits performing at their best and prevents overheating. Use thermal simulation tools to predict heat distribution across your PCB, identify hotspots, and ensure adequate heat dissipation. Implement strategies like heat sinks or improved airflow to keep everything running cool and efficient. Protecting Against Electrostatic Discharge (ESD):  ESD protection is crucial for shielding sensitive components from voltage spikes. Implement ESD protection measures like TVS diodes or robust PCB layouts to prevent damage and enhance the long-term reliability of your devices. Why Electrical Stress Analysis Matters Investing time in electrical stress analysis pays off in several ways: Boost Your Product’s Reliability:  By catching and addressing potential issues early, you’ll create more reliable and durable products. This proactive approach leads to fewer field failures and greater customer satisfaction. Cut Development Costs:  Addressing issues during the design phase helps avoid costly rework and redesigns. Effective electrical stress analysis means fewer unexpected problems and delays, saving you time and money. Enhance Safety:  By managing risks related to overheating or electrical overstress, you ensure your products are safe. Thorough analysis helps you keep everything within safe limits, reducing the chances of safety hazards or malfunctions. Ease Regulatory Compliance:  Electronics often need to meet strict standards like those from the European Space Agency (ESA), NASA, or NAVSEA. Electrical stress analysis helps you meet these benchmarks, ensuring your designs are safe, reliable, and ready for certification. Tools and Techniques for Electrical Stress Analysis Manual Calculations:  Manual calculations give you a fundamental understanding but can be labor-intensive and prone to errors, especially for complex designs. Simulation Software:  Advanced simulation tools provide a more efficient way to analyze electrical stress. They simulate electrical behavior, power integrity, and thermal distribution, giving you detailed insights and allowing you to optimize your designs. Derating Tables and Calculators:  These resources simplify the derating process by offering quick access to derating factors based on component specifications and environmental conditions. How Automation Can Simplify Electrical Stress Analysis As designs become more complex, automation helps manage the growing demands of analysis. Tools like the Synthelyzer™ ECAD Plugin  offer a significant upgrade: Efficient Derating Calculations:  Synthelyzer™ streamlines derating by using current data, reducing manual effort, and cutting down on errors compared to traditional methods. Seamless ECAD Integration:  The Synthelyzer™ plugin integrates smoothly with major ECAD tools like Altium, OrCAD, and Mentor, minimizing manual data entry and keeping your analysis aligned with the latest schematic designs. Dynamic Updates and Feedback:  Synthelyzer™ keeps you in sync with design changes by leveraging up-to-date schematic data. It helps you quickly identify and resolve potential electrical stress issues, making your design process more robust and efficient. Detailed Reporting:  Generate comprehensive reports on stress derating and reliability metrics, aiding in compliance with industry standards and providing valuable documentation for design reviews and certification. Best Practices for Effective Electrical Stress Analysis To make the most of electrical stress analysis, follow these best practices: Start Early:  Incorporate electrical stress analysis early in the PCB design process to identify and address issues before they impact development timelines. Conduct Thorough Analysis:  Cover both electrical and thermal aspects to get a complete picture of potential stress points and their implications. Leverage Simulation Tools:  Use advanced simulation software to predict component behavior and pinpoint potential hotspots, helping you optimize your design and prevent failures. Prepare for Worst-Case Scenarios:  Assess the impact of extreme conditions like maximum operating temperatures or sudden voltage surges to ensure your design can handle severe situations and maintain reliable performance. Keep Your Analysis Up-to-Date:  Update your electrical stress analysis as design changes occur to ensure it remains accurate and relevant throughout the development process. Conclusion Electrical stress analysis is a critical part of PCB design, ensuring the long-term reliability and safety of your electronic devices. By understanding its principles, using effective tools like the Synthelyzer™ ECAD Plugin, and following best practices, you can address electrical overstress, enhance board performance, and achieve outstanding product reliability. To see how Synthelyzer™ can transform your design process and elevate your stress analysis capabilities, visit the Synthelyzer™ ECAD Plugin webpage.

In the ever-evolving realm of electronic design, ensuring reliability, availability, maintainability, and safety (RAMS) are paramount concerns for professionals across industries. The seamless integration of design modifications with analysis results is a game-changer, providing a competitive edge through unparalleled accuracy and efficiency. Enter CARE® - a revolutionary tool that redefines how electronic RAMS analysis is approached, by dynamically linking and instantly updating design changes directly within your analysis results. The Power of Integration: CARE® and ECAD Plugin Imagine a tool that effortlessly synchronizes your electronic design modifications with real-time updates to your RAMS analysis. That's precisely what CARE® offers through its seamless integration with our ECAD plugin. The synergy between these two powerful tools empowers professionals to achieve new heights of precision and effectiveness in their electronic design processes. Dynamic Linking for Unmatched Precision One of the standout features of CARE® is its dynamic linking capability. This functionality allows design changes to be instantly reflected in the RAMS analysis, ensuring that professionals are always working with the most up-to-date information. By eliminating the need for manual updates and data transfers, CARE® streamlines the entire process, saving time and minimizing the risk of errors. Real-Time Synchronization: Efficiency at Its Best Efficiency is key in today's fast-paced design environment, and CARE® delivers on this front by offering real-time synchronization between design modifications and analysis results. Professionals can now make informed decisions with confidence, knowing that their analysis is based on the latest design information. This real-time feedback loop ensures that any changes are immediately integrated, keeping projects on track and within parameters. Enhanced Decision-Making and Risk Mitigation With CARE® and the ECAD plugin working in tandem, professionals have a powerful toolkit at their disposal to enhance decision-making processes and mitigate risks effectively. The ability to see the impact of design changes in real-time allows for proactive adjustments and thorough risk assessments, ultimately leading to more robust and reliable electronic systems. Closing Thoughts In conclusion, the integration of design modifications directly into electronic RAMS analysis results through CARE® represents a significant leap forward for professionals seeking unparalleled accuracy and efficiency in their work. By embracing dynamic linking and real-time synchronization, professionals can navigate the complexities of electronic design with confidence, knowing that they have the tools to achieve optimal outcomes. Learn more about CARE® SEO Keywords : Electronic Design, RAMS Analysis, Real-Time Synchronization, Dynamic Linking, ECAD Plugin, Design Modifications, Risk Mitigation

Introduction In the aerospace industry, where reliability is paramount, the integrity of electronic circuits must go beyond reproach. With rigorous environmental conditions and complex system demands, aerospace PCB designers face unique challenges. To meet these challenges head-on, adopting the FIDES 2022 standard and leveraging advanced tools like fiXtress®  can significantly enhance the reliability and performance of your designs. This blog post explores why FIDES 2022 is essential for aerospace PCB designers and how fiXtress®  can transform your reliability analysis approach. Why Aerospace PCB Designers Need FIDES 2022 The aerospace industry is characterized by its high standards for reliability and performance, driven by: Harsh Environmental Conditions : Aerospace PCBs operate in extreme environments, including high vibrations, fluctuating temperatures, and radiation. FIDES 2022 provides updated and accurate failure rate data, including new models and classifications, to predict component performance under these conditions more effectively. Complex Systems Integration : Aerospace systems involve intricate PCB assemblies with numerous interconnections. FIDES 2022 offers comprehensive prediction models for these complex systems, helping designers identify potential points of failure and enhance overall system robustness. Technological Evolution : As technology advances, so do the components used in aerospace PCBs. FIDES 2022 reflects the latest advancements with new component categories and improved prediction methods, ensuring your designs are based on the most current and relevant data. How fiXtress® Enhances Aerospace PCB Reliability fiXtress®  is designed to work seamlessly with the FIDES 2022 methodology, offering aerospace PCB designers a suite of advanced features: In-Depth Electrical Stress Analysis : fiXtress®  performs detailed electrical stress derating analysis for both single and multi-board systems. This capability helps identify overstressed components and optimize performance, aligning with FIDES 2022's comprehensive prediction models. Advanced Thermal Management : fiXtress®  estimates PCB temperature rise caused by IC heat generation, providing critical data for thermal management and stress derating. This ensures that components remain within safe temperature limits, crucial for aerospace applications. EOS Violation Detection : Electrical Over-Stress (EOS) can lead to critical failures. fiXtress®  detects EOS violations through detailed reports and actionable recommendations, helping prevent potential issues and ensuring compliance with FIDES 2022 guidelines. Realistic MTBF Predictions : Mean Time Between Failures (MTBF) is essential for planning maintenance and ensuring the longevity of aerospace systems. fiXtress®  provides accurate MTBF predictions based on real electrical and thermal stresses, in accordance with FIDES 2022 standards. Seamless ECAD Integration : fiXtress®  integrates with major Electronic Design Automation (EDA) tools like Altium, Mentor, and OrCAD. This allows for real-time analysis during the design phase, streamlining workflows and accelerating time-to-market. Benefits for Aerospace PCB Designers Enhanced Accuracy and Reliability : By integrating FIDES 2022 and fiXtress® , aerospace PCB designers can ensure their designs meet the highest reliability standards, reducing the risk of failures and improving system performance. Optimized Thermal and Electrical Performance : fiXtress®  provides insights into thermal and electrical stresses, allowing for effective component placement and cooling strategies, essential for maintaining reliability in extreme aerospace conditions. Efficient Design Process : The automation features of fiXtress®  streamline the reliability analysis process, saving time and minimizing errors, leading to faster iterations and more reliable designs. Future-Proof Designs : FIDES 2022’s updated models and fiXtress® ’s advanced capabilities ensure that your aerospace PCBs are not only reliable today but also adaptable to future technological advancements. Conclusion For aerospace PCB designers striving for excellence, integrating the FIDES 2022 standard with fiXtress®  offers a strategic advantage. These tools provide the precision and insights needed to tackle the unique challenges of aerospace systems, ensuring your PCBs are reliable, robust, and ready to meet industry demands. Explore how fiXtress® can transform your PCB design process and elevate your reliability analysis . .

Introduction In the aerospace industry, where safety, performance, and reliability are non-negotiable, the stakes for designing and manufacturing electronic systems are extraordinarily high. The FIDES 2022 methodology, a pivotal advancement in reliability prediction, offers a critical tool for aerospace engineers striving for excellence. When integrated with fiXtress® , a state-of-the-art reliability analysis software, aerospace professionals can ensure their designs meet the rigorous standards required for successful missions. This blog explores why FIDES 2022 is crucial for aerospace applications and how fiXtress®  leverages this standard to enhance reliability and performance. Why Aerospace Industry Needs FIDES 2022 The aerospace industry demands exceptionally high reliability due to the harsh environments and critical nature of its applications. Here's why adopting the FIDES 2022 methodology is crucial: Precision in Reliability Prediction : Aerospace systems operate in extreme conditions, where traditional reliability models may fall short. FIDES 2022 introduces updated failure rate values and new component classifications, offering more precise predictions of component lifetimes and failure probabilities under real-world conditions. Component Classification Updates : The introduction of new classifications, such as X5R and X7R for Type-2 ceramic capacitors, ensures that components are assessed with the most current data. This level of detail is essential for aerospace applications, where component performance directly impacts mission success and safety. Enhanced MTBF Predictions : Accurate Mean Time Between Failures (MTBF) predictions are vital for mission planning and risk management in aerospace. FIDES 2022 provides improved models for predicting MTBF, which helps engineers design systems with better reliability and longer service life. How fiXtress® Enhances Aerospace Reliability fiXtress®  is tailored to maximize the benefits of the FIDES 2022 methodology, offering aerospace engineers powerful tools for reliability analysis and optimization: Comprehensive Electrical Stress Analysis : fiXtress®  performs in-depth analysis of electrical stress on components, crucial for understanding how components will behave under the extreme conditions typical of aerospace applications. By integrating FIDES 2022 standards, the software ensures that these analyses reflect the latest reliability data and predictions. Advanced Temperature Prediction : Accurate thermal management is critical in aerospace design. fiXtress®  estimates PCB temperature rise due to IC heat generation, allowing engineers to manage thermal stress effectively and prevent overheating issues that could jeopardize mission integrity. EOS Violation Detection : The software identifies Electrical Over-Stress (EOS) violations with detailed reports and actionable recommendations. This feature helps aerospace engineers address potential failures before they impact system performance, enhancing overall reliability. Realistic MTBF Predictions : fiXtress®  leverages the FIDES 2022 methodology to provide realistic MTBF predictions based on actual electrical and thermal stresses. This capability is essential for planning maintenance schedules and ensuring long-term reliability in demanding aerospace environments. Seamless Integration with EDA Tools : fiXtress®  integrates with major Electronic Design Automation (EDA) tools, streamlining the design process and allowing for real-time reliability analysis. This integration facilitates a smoother workflow and faster identification of potential issues. Benefits for Aerospace Professionals Improved Reliability and Safety : By adopting FIDES 2022 standards and using fiXtress® , aerospace engineers can ensure that their designs meet the highest reliability standards, reducing the risk of component failure and enhancing mission safety. Optimized Design Process : fiXtress®  automates many aspects of reliability analysis, saving valuable time and reducing the likelihood of human error. This efficiency is critical in the fast-paced aerospace industry, where precision and reliability are paramount. Enhanced Performance and Longevity : The ability to predict and address potential issues before they arise ensures that aerospace systems perform optimally and have a longer service life, which is essential for high-stakes missions. Conclusion The FIDES 2022 methodology represents a significant leap forward in reliability prediction, and its integration with fiXtress®  offers aerospace engineers a powerful tool for designing reliable and high-performing systems. By leveraging the latest standards and advanced features of fiXtress® , aerospace professionals can achieve the precision, safety, and performance required for successful missions. For more information on how fiXtress®  can enhance your aerospace design process, visit fiXtress® webpage to learn more.

In the competitive world of electronics design, achieving long-term reliability is more than just a goal—it's a necessity. A critical technique to ensure the durability and dependability of your electronic components is derating. This blog post explores the concept of derating in-depth, highlights its importance for reliable electronics design, and demonstrates how the Synthelyzer™ ECAD Plugin can optimize this crucial process. What is Derating and Why is it Essential? Derating refers to the practice of operating electronic components below their maximum rated capacity to enhance their longevity and reliability. By intentionally using components under their maximum specifications, engineers can significantly reduce the likelihood of failure. Key Benefits of Derating: 1. Minimizes Stress on Component s: Operating components well within their limits reduce the stress they experience, lowering the risk of premature failure. 2. Enhances Component Longevity : Components used at lower stress levels typically have a longer operational life, making them more reliable in the long run. 3. Improves Safety and Compliance : In critical applications, such as aerospace or medical devices, derating helps ensure components meet stringent safety and regulatory standards. The Role of Synthelyzer™ ECAD Plugin in Derating The **Synthelyzer™ ECAD Plugin** is a sophisticated tool designed to streamline and enhance the derating process within your PCB design workflow. Here's how it can help you achieve superior reliability: Automated Stress Calculations The plugin features advanced automated circuit stress calculators that facilitate precise derating of electronic components. Integrating these calculations into your design process ensures that components are consistently operated within safe limits. 2. Integration with Thermal Simulation Effective derating is closely linked with thermal management. Synthelyzer™ leverages thermal simulation results to provide accurate derating data. This integration allows you to assess how thermal stress impacts component performance and adjust your design accordingly. 3. Detailed Analysis and Recommendations Synthelyzer™ excels in identifying overstressed components and providing actionable recommendations for design improvements. This proactive approach helps you address potential issues before they manifest in field failures, enhancing overall design robustness. 4. Seamless ECAD Integration The plugin integrates effortlessly with leading ECAD software, providing real-time analysis and updates. This seamless integration ensures that derating considerations are incorporated into your design workflow without disrupting your existing processes. Real-World Applications and Impact Incorporating derating strategies through advanced tools like Synthelyzer™ has a tangible impact on design reliability. For instance: - Aerospace and Defense : Components in these sectors are subject to harsh conditions. Derating helps ensure they perform reliably throughout their extended lifespan. - Automotive: In automotive electronics, derating minimizes the risk of component failure in critical systems, enhancing vehicle safety and performance. - Medical Devices : For medical applications, derating is crucial in maintaining the safety and reliability of life-critical devices. How to Optimize Your PCB Design with Synthelyzer™ To ensure your electronic designs are both reliable and durable, it's essential to integrate effective derating strategies early in the design process. The Synthelyzer™ ECAD Plugin offers a comprehensive solution for this, providing automated, precise, and actionable derating data. Ready to Enhance Your Design Reliability? Discover how the Synthelyzer™ ECAD Plugin can transform your PCB design process with advanced derating capabilities and more. Visit our [Synthelyzer™ page](#) to explore our innovative solutions and learn how they can help you achieve robust, reliable designs. By leveraging advanced derating techniques with the Synthelyzer™ Plugin, you are investing in the long-term success and dependability of your electronic products. Don’t wait for field failures to impact your designs—take proactive steps today with our state-of-the-art tools. For more detailed information and to see the Synthelyzer™ Plugin in action, visit our Synthelyzer™ page.

Introduction Ensuring PCB (Printed Circuit Board) reliability is vital to avoid costly failures and ensure high performance. By integrating advanced analysis tools with established best practices, engineers can significantly enhance the robustness of their designs. This blog post explores key strategies for improving PCB reliability, focusing on concepts like derating, stress analysis, and the Synthelyzer™ ECAD Plugin, which offers comprehensive tools for achieving reliable and high-quality designs. 1. Understanding PCB Reliability Reliability is crucial in PCB design to ensure that designs perform consistently throughout their lifespan. Common issues include unexpected reboots, safety function malfunctions, and operational problems due to thermal stress. Addressing these issues early in the design phase can prevent costly field failures and extend the product's life. 2. The Importance of Derating Derating involves operating components below their maximum rated limits to enhance reliability and extend their lifespan. Concept of Derating : For instance, using a capacitor rated for 2.5 volts in a circuit designed for 5 volts provides a safety margin, reducing the risk of failure. Implementing Derating with Synthelyzer™ : The Synthelyzer™ ECAD Plugin automates derating by integrating guidelines directly into the design workflow. This helps ensure components are used within their safe operating limits, minimizing overstress risks and potential failures. 3. Advanced Stress Analysis and Thermal Simulation Effective stress analysis and thermal simulation are essential for identifying and addressing design issues before they become critical. Stress Analysis : The Synthelyzer™ Plugin includes automated circuit stress calculators that identify potential stress points, such as incorrect grounding of DC to DC converters, early in the design process. Thermal Simulation : The plugin enhances derating accuracy by utilizing thermal resistance data, ensuring components perform reliably under real-world thermal conditions. 4. Automating Reliability Analysis with Synthelyzer™ The Synthelyzer™ ECAD Plugin provides a suite of features designed to streamline and automate the reliability analysis process: Automated Calculations : The plugin automates stress and thermal calculations, reducing manual errors and accelerating the design process. FMECA and MTBF : It performs Failure Modes, Effects, and Criticality Analysis (FMECA) and calculates Mean Time Between Failures (MTBF) using industry standards like Telcordia and Mil-217-F2, offering insights into potential failure modes and their impacts. AI Integration : The plugin features an AI-driven components library that automatically fills parameters, making it easier to incorporate reliability data into designs. 5. Industry Applications and Impact Advanced reliability tools like the Synthelyzer™ Plugin have significant applications across various industries: Aerospace : Ensures critical systems operate reliably over extended periods, preventing severe consequences from failures. Automotive : Enhances vehicle safety by preventing costly recalls and ensuring component performance. Telecommunications : Ensures robust performance and reduces field failures in equipment that must operate under diverse conditions. 6. Best Practices for Implementing Reliability Tools To maximize the benefits of advanced reliability tools, follow these best practices: Integrate Early : Use tools like the Synthelyzer™ Plugin early in the design phase to identify and address issues before they become critical. Leverage Automation : Utilize automated features for derating, stress analysis, and MTBF calculations to save time and minimize errors. Maintain Traceability : Regularly update reliability data to reflect the latest design changes, ensuring accuracy and relevance throughout the design process. Conclusion Enhancing PCB reliability involves combining expert knowledge with advanced tools. By integrating derating principles with sophisticated analysis tools such as the Synthelyzer™ ECAD Plugin, engineers can improve PCB design robustness significantly. Adopting these best practices and tools will help prevent field failures, reduce costs, and ensure reliable product performance. Explore how the Synthelyzer™ ECAD Plugin can revolutionize your PCB design process. Incorporate advanced reliability analysis into your workflow and experience the benefits of more robust and reliable designs. For more information, visit the Synthelyzer™ website and see how these tools can enhance your design practices.

Challenge for ASIC Manufacturer: ASIC manufacturers grapple with the imperative task of ensuring that their customers correctly employ ASICs according to specifications and adhere to the reference design. Mobileye encountered this challenge in integrating their Advanced Driver Assistance System (ADAS) technology with various car manufacturers. Solution: By leveraging BQR's CircuitHawk Automatic Schematic Review (ASR), Mobileye efficiently executed systems verification and conducted comprehensive testing of the electronic chip integrated into the vehicle. Key Benefits: Significantly reduce manual checking time, saving weeks of effort. Accelerate time to manufacturing through shorter test cycles. Enhance chip reliability by identifying and eliminating hidden errors. Mitigate potential vehicle hazards, averting high costs and safeguarding reputation.

What is component derating analysis? The maximum rating for applied component stress (current, voltage, power, temperature, etc.) is defined by the manufacturer, and even stricter derating guidelines are defined to increase product robustness. Component derating analysis defines the optimal operating range for each component.   Why You Need Component Derating Analysis Component damage may occur when it is subjected to power, current, voltage, or temperature which surpasses its maximum stress rating.Electrical overstress affects product performance and is the leading cause of field returns.   ​   Many engineers select components that have a maximal rating which is twice the expected actual stress. However, as temperatures increase, component performance deteriorates, this practice becomes insufficient, and derating guidelines must be applied.   Component derating analysis helps you select the optimal component rating according to stress load and temperature.       The analysis detects over-rating (red) and over-derating (yellow) components. Over-designed components are also detected when stress is much lower than the rating.In many companies, the process is performed manually and includes time-consuming tasks: Calculating component stresses and comparing the result with the derating guidelines for each component type.   BQR Component Derating Analysis fiXtress® , an AI-powered BQR solution, automates manual component stress and derating analysis, optimizing component selection for reliability and cost-effectiveness. ​ Features: Plug-ins for major E-CADs (Altium, Mentor, OrCad) provide easy BOM import as well as present results on the schematic design. Stress can be input semi-automatically or calculated using a unique circuit stress simulator. The derating guidelines can be customized according to standards [1-6] or your company’s practice. Thermal placement guidelines in the form of a Pareto list, for optimal placement during layout. Additional uses for stress results: Once the component stresses are defined, additional analyses can be held: BQR’s patented schematic review detects a wide variety of design errors before layout. Some of the errors depend on stress, for example: incorrect applied voltage. BQR’s MTBF calculation software uses the defined stresses for realistic MTBF prediction.   ​   References: [1] ECSS-Q-ST-30-11C Space product assurance – Derating – EEE components[2] US Navy Derating Guideline, SD-18[3] Air force space command SMC Standard SMC-S-010[4] NASA EEE-INST-002 Instructions for EEE Parts Selection, Screening, Qualification, and Derating[5] IPC-9592 Performance Parameters for Power Conversion Devices[6] Mil-Hdbk-338 Military Handbook Electronic Reliability Design Handbook Learn More About fiXtress®

In the realm of critical and complex systems, meticulous design, analysis, verification, and validation are paramount. The primary goal is to minimize prototype failures, reduce root cause analysis and design cycles, and avert field failures and safety incidents. Customers increasingly demand robust safety, diagnostics, reliability, and logistic support analyses that adhere to relevant standards. While some engineers may view these analyses as burdensome, they can significantly enhance the system design process. Enter MBSE Model-Based Systems Engineering (MBSE) has gained traction in recent years, though its principles have long been in practice under various guises. For instance, when an electrical engineer utilizes CAD software to design a circuit board, they are effectively engaging in MBSE. Today’s advanced MBSE tools streamline system modeling, enhance traceability, and facilitate rigorous analysis and simulations. Choosing the right tool can save time and provide invaluable insights. Here are five key MBSE analyses that can empower you to make informed design decisions: 1. Circuit Verification Designing complex electronic circuits is fraught with potential errors. Traditional Design Rule Checks (DRCs) often miss critical issues, resulting in prolonged and costly design cycles. BQR’s model-based circuit analysis tools, such as fiXtress®  and CircuitHawk™ , enable you to identify hidden design flaws before layout through: Advanced DRC with customizable rules Circuit simulation for component stress testing Component derating analysis 2. FMEA for Electronic Designs Failure Mode and Effects Analysis (FMEA) has been a cornerstone in identifying single points of failure and critical failure modes. It also serves as the foundation for testability and diagnostic analysis, along with Fault Tree Analysis (FTA). BQR’s FMEA/FMECA software provides: CAD software integration for easy functional breakdown A comprehensive electronic components failure modes library A flexible Risk Matrix compliant with major standards Seamless integration with BQR’s MTBF prediction software In-depth Testability and Diagnostics Analysis 3. Reliability Analysis High-reliability systems often feature redundancies and backups. During the early design phase, a "reliability allocation" is essential to outline redundancy architecture. As the design matures, BQR’s Reliability Block Diagram (RBD) software allows for: Modeling of complex systems with various redundancy types (hot, cold, standby) Sensitivity and numerical analysis, including Monte Carlo simulations 4. Safety Analysis Functional safety analysis is critical for compliance with safety requirements in complex systems, which may include built-in tests and fault tolerance. Fault Tree Analysis (FTA) helps dissect severe safety events that may arise from combinations of failure modes. BQR’s FTA software facilitates: Effortless modeling of intricate safety events Consideration of various redundancies and protective layers Integration with BQR’s FMECA for comprehensive safety evaluations 5. Model-Based Logistic Support Analysis Recent global events, including the COVID-19 pandemic, have highlighted the importance of Logistic Support Analysis (LSA) amid supply chain disruptions. Model-based LSA optimizes logistics strategies for systems, covering aspects such as: Spare part provisioning Stock location optimization Repair versus discard decisions Vendor selection BQR’s apmOptimizer®  is a cutting-edge model-based tool that empowers you to: Calculate expected lifecycle costs Optimize logistic support strategies Conclusion Leading companies are increasingly leveraging BQR’s MBSE tools for data-driven analysis and decision-making, resulting in improved safety, reliability, and maintainability of their systems. Embracing MBSE can transform your design process, ensuring that your systems not only meet but exceed customer expectations.

Background: Safety standards, including EN-50126, EN-50128, and EN-50129, are paramount in the rail industry, requiring product designers to adhere to stringent reliability and functional safety regulations. To meet these demands, a prominent rolling stock Original Equipment Manufacturer (OEM) has integrated BQR's advanced software solutions into its design processes. Client Profile: A leading OEM in the rolling stock sector, committed to delivering cutting-edge solutions while ensuring the highest safety and reliability standards. Challenges: Compliance with rigorous industry safety standards. Conducting comprehensive Reliability, Availability, Maintainability, and Safety (RAMS) analyses for rolling stock and signalling systems. BQR Solutions Implemented: MTBF Prediction Software: Integrated BQR's MTBF prediction software into the design RAMS activities. Ensured adherence to industry standards and compliance with safety regulations. Fault Tree Analysis (FTA) Software: Employed BQR's FTA software to calculate failure probabilities for Safety Instrumented Functions (SIF). Tackled complex Fault Trees with hundreds of end events and over 30 common causes, including nested common causes. Outcomes: Efficient Failure Probability Calculations: BQR's FTA software swiftly computed failure probabilities for intricate Fault Trees. Identified leading minimal cut-sets, crucial for understanding SIF failure events. Enhanced System Robustness and Reliability: Detected weak points in the system, allowing for targeted improvements. Demonstrated that the failure probability aligns with the stringent limits required by industry standards. Benefits: Compliance Assurance: Enabled the OEM to meet and exceed safety and reliability standards. Demonstrated a commitment to compliance with industry regulations. Operational Efficiency: Streamlined design RAMS activities with the integration of BQR's MTBF prediction software. Improved efficiency in calculating failure probabilities and analyzing complex Fault Trees. System Optimization: Identified and addressed system vulnerabilities, enhancing overall robustness. Provided insights for continuous improvement in system reliability. Conclusion: By leveraging BQR's advanced MTBF prediction and FTA software solutions, the leading rolling stock OEM successfully enhanced its RAMS activities, ensuring the highest levels of safety, reliability, and compliance with industry standards. The integration of BQR software has not only streamlined operational processes but has also positioned the client as a pioneer in meeting and exceeding the stringent safety requirements of the rail industry.

Introduction: BQR collaborated with Mekorot, Israel's national water company, to assess the availability of the main water pumps at the Eshkol water filtration plant. The pumping station, crucial for the national water supply system, comprises eight pumps with a capacity of 75,000m³/hour and a lifting capacity of 15 meters. Challenge: The challenge involved analyzing historical failure and maintenance records obtained from SCADA and SAP-ERP systems. The goal was to develop a comprehensive reliability and availability model for the pumps, considering varying scenarios of capacity demand and maintenance policies. Solution: Leveraging BQR-Digital Field Data Analysis and apmOptimizer software, the analysis successfully addressed the complexities of different scenarios, ensuring the required operational pumps in diverse conditions were accounted for. The model also factored in the probability of depleting the distribution reservoir, which has a capacity of 130,000m³. Results: Reliability and availability results were meticulously calculated for multiple scenarios, leading to actionable recommendations for enhancing system reliability. The analysis indicated that a 5% additional investment (compared to the initial investment) could result in a remarkable 20% reduction in downtime. Field Failure Rate: The comprehensive assessment included a thorough analysis of the field failure rate, providing valuable insights for optimizing the performance and maintenance strategy of the water pumps.   This collaborative effort with Mekorot exemplifies BQR's commitment to delivering tailored solutions for critical infrastructure, ensuring optimal performance and reliability in vital water supply systems.